现行

IEC 60191-4-2013/AMD1-2018

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
修改件1.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

现行

IEC 60191-2-1966/AMD1-2001

Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件1.半导体器件的机械标准化.第2部分:尺寸

2001-03-15

现行

IEC 60191-2-1966/AMD8-2003

Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件8——半导体器件的机械标准化 第2部分:尺寸

2003-06-27

现行

IEC 60191-2-1966/AMD12-2006

Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件12.半导体器件的机械标准化.第2部分:尺寸

2006-03-24

现行

IEC 60191-2-1966/AMD10-2004

Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件10.半导体器件的机械标准化.第2部分:尺寸

2004-03-29

现行

IEC 60191-2-1966/AMD14-2006

Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件14.半导体器件的机械标准化.第2部分:尺寸

2006-07-17

现行

IEC 60191-2-1966/AMD20-2018

Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件20.半导体器件的机械标准化.第2部分:尺寸

2018-04-12

现行

IEC 60191-2-1966/AMD5-2002

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件5——半导体器件的机械标准化 第2部分:尺寸

2002-02-12

现行

IEC 60191-2-1966/AMD15-2006

Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件15.半导体器件的机械标准化.第2部分:尺寸

2006-07-17

现行

IEC 60191-2-1966/AMD19-2012

Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件19.半导体器件的机械标准化.第2部分:尺寸

2012-10-02

现行

IEC 60191-2-1966/AMD11-2004

Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件11.半导体器件的机械标准化.第2部分:尺寸

2004-11-23

现行

IEC 60191-2-1966/AMD7-2002

Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件7——半导体器件的机械标准化 第2部分:尺寸

2002-05-10

现行

IEC 60191-2-1966/AMD21-2020

Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件21.半导体器件的机械标准化.第2部分:尺寸

2020-02-13

现行

IEC 60191-2-1966/AMD9-2003

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件9.半导体器件的机械标准化.第2部分:尺寸

2003-11-19

现行

IEC 60191-2-1966/AMD16-2007

Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件16.半导体器件的机械标准化.第2部分:尺寸

2007-07-25

现行

IEC 60191-2-1966/AMD3-2001

Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件3.半导体器件的机械标准化.第2部分:尺寸

2001-08-28

现行

IEC 60191-2-1966/AMD17-2008

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件17.半导体器件的机械标准化.第2部分:尺寸

2008-05-27

现行

IEC 60191-2-1966/AMD2-2001

Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件2.半导体器件的机械标准化.第2部分:尺寸

2001-06-20

现行

IEC 60191-2-1966/AMD13-2006

Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件13.半导体器件的机械标准化.第2部分:尺寸

2006-07-17

现行

IEC 60191-2-1966/AMD18-2011

Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件18.半导体器件的机械标准化.第2部分:尺寸

2011-11-22