现行

KS C IEC 60249-2-1(2017 Confirm)

인쇄 회로 기판 재료－제2부：규격－제1장：고급형 페놀셀룰로오스 종이 동입힘 적층판
印制电路用基材第2部分:规范第1号规范:高电气质量酚醛纤维素纸覆铜箔层压板

2002-05-30

现行

UNE-EN 60249-2-1/A2-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICAION Nº1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
印刷电路的基材 第2部分:规范 规格1:酚醛纤维素纸覆铜层压板 高电气质量

1996-10-14

现行

UNE-EN 60249-2-2/A3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14

现行

UNE-EN 60249-2-2-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14

现行

UNE-EN 60249-2-2/A4-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14

现行

UNE-EN 60249-2-1/A3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
印刷电路的基材 第2部分:规范 规格1:高电气质量酚醛纤维素纸覆铜箔层压板

1996-10-09

现行

UNE-EN 60249-2-1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY.
印刷电路的基材 第2部分:规范 规格1:高电气质量酚醛纤维素纸覆铜箔层压板

1996-07-24

现行

KS C IEC 60249-2-7(2017 Confirm)

인쇄 회로 기판 재료－ 제2부：규격－제7장：가연성 페놀셀룰로오스 종이 동입힘 적층판 (수직 연소 시험)
印制电路用基材第2部分:规范第7号规范:规定可燃性的酚醛纤维素纸覆铜层压板（垂直燃烧试验）

2002-05-30

现行

BS 4584-5-1972

Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality: PF-CP-Cu-5
印制电路用金属覆层基材规范 中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-5

1972-07-28

现行

UNE-EN 60249-2-6-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 6: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (HORIZONTAL BURNING TEST).
印刷电路的基材 第2部分:规范 规范6:规定可燃性的酚醛纤维素纸覆铜层压板（水平燃烧试验）

1996-07-24

现行

UNE-EN 60249-2-7-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 7: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
印刷电路的基材 第2部分:规范 规范7:规定可燃性的酚醛纤维素纸覆铜层压板（垂直燃烧试验）

1996-07-24

现行

UNE-EN 60249-2-14-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范Nº14:规定可燃性（垂直燃烧试验）经济质量的酚醛纤维素纸覆铜层压板

1996-07-24

现行

BS 4584-6-1972

Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality, flame retardant grade: PF-CP-Cu-6
印制电路用金属覆层基材规范 阻燃级中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-6

1972-07-28

现行

BS EN 61249-2-1-2005

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
印制板和其他互连结构用材料

2005-08-09

现行

BS EN 61249-2-2-2005

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
印制板和其他互连结构用材料

2006-06-30

现行

BS EN 61249-2-23-2005

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
印制板和其他互连结构用材料

2005-08-25

现行

IEC 61249-2-1-2005

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
印刷电路板及其他互连结构材料 - 第2-1部分:增强基材 包层和不包覆 - 酚醛纤维素纸增强层压板 经济级铜包层

2005-01-11

现行

KS C IEC 61249-2-1(2016 Confirm)

인쇄 회로 기판 및 기타 연결 구조 재료－제2－1부：동박 및 무동박 보강재－셀룰로오스 종이 기재 페놀 수지 동박 적층판, 경제적 등급
印制板和其他互连结构用材料第2－1部分:包层和非包层增强基材经济级包铜酚醛纤维素纸增强层压板

2006-12-26

现行

KS C IEC 61249-2-1(2021 Confirm)

인쇄 회로 기판 및 기타 연결 구조 재료－제2－1부：동박 및 무동박 보강재－셀룰로오스 종이 기재 페놀 수지 동박 적층판, 경제적 등급
印制板和其他互连结构用材料第2－1部分:包层和非包层增强基材经济级包铜酚醛纤维素纸增强层压板

2006-12-26

现行

KS C IEC 61249-2-2

회로기판 및 다른 내부 접속용 구조를 위한 재료 — 제2-2부: 강화 원자재, 덮임 및 비덮임 — 페놀수지를 적용한 셀룰로오스 종이 강화 시트, 고전기 등급, 동박 적층
印制板和其他互连结构用材料第2-2部分:覆层和非覆层增强基材覆铜高电气级酚醛纤维素纸增强层压板

2022-06-28