现行

UNE 20620-4-1980

METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. COPPER FOIL
印制电路用金属包覆基材 铜箔

1980-12-15

现行

BS 4584-103.2-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 覆铜基材制造用铜箔规范

1990-02-28

现行

GB/T 36476-2018

印制电路用金属基覆铜箔层压板通用规范
General specification for metal base copper-clad laminates for printed circuits

2018-06-07

现行

BS 4584-103.1-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 多层印制板制造中用作粘合片材料的预浸料规范

1990-02-28

现行

BS 4584-13-1977

Specification for metal-clad base materials for printed circuits-Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13
印制电路用金属覆层基材规范 硅机织玻璃纤维覆铜层压板Si-GC-Cu-13

1977-11-30

现行

BS 4584-103.3-1992

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 印制板制造用永久性聚合物涂层材料（阻焊剂）规范

1992-03-31

现行

BS EN 60249-2-13-1994

Base material for printed circuits. Specifications-Flexible copper-clad polyimide film, general purpose grade
印刷电路的基材 规格 通用级挠性覆铜聚酰亚胺薄膜

1990-02-28

现行

BS EN 60249-2-3-1994

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

现行

UNE 20620-3-1-1981

METAL-CLAS BASE MATERIALS FOR PRINTED CIRCUITS. SPECIAL MATERIALS. SPECIFICATION NO.1: PRE-PREG FOR MULTILAYER PRINTED BOARDS
印刷电路板用金属覆层基材 特殊材料 规范1:多层印制板的预浸

1981-12-15

现行

UNE-EN 60249-2-8-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-07-24

现行

UNE-EN 60249-2-8/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
印刷电路的基材 第2部分:规范 规格8:柔性覆铜聚酯（PETP）薄膜

1996-10-23

现行

BS 4584-6-1972

Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality, flame retardant grade: PF-CP-Cu-6
印制电路用金属覆层基材规范 阻燃级中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-6

1972-07-28

现行

UNE-EN 60249-2-15/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-10-14

现行

UNE-EN 60249-2-15-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY.
印刷电路的基材 第2部分:规范 规范15:规定易燃性的挠性覆铜聚酰亚胺薄膜

1996-07-24

现行

UNE-EN 60249-2-13/A1-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-10-16

现行

UNE-EN 60249-2-13-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范13:通用级挠性覆铜聚酰亚胺薄膜

1996-07-24

现行

KS C IEC 60249-2-1(2017 Confirm)

인쇄 회로 기판 재료－제2부：규격－제1장：고급형 페놀셀룰로오스 종이 동입힘 적층판
印制电路用基材第2部分:规范第1号规范:高电气质量酚醛纤维素纸覆铜箔层压板

2002-05-30

现行

UNE-EN 60249-2-2/A3-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14

现行

UNE-EN 60249-2-2-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14

现行

UNE-EN 60249-2-2/A4-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14