提供了一种评估电子设备可用性的方法，适用于涉及玻璃到金属密封件的应用，或依赖于氧化铜粘附膜的形成和存在的其他用途。该程序包括在空气中制备和加热试样，然后在水中快速冷却，并目视检查氧化膜损失或起泡。

Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.