本文件描述了一种测试焊料凸点（包括倒装芯片封装中使用的其他类型的凸点，如带焊料帽的铜柱）电迁移（EM）敏感性的方法。该方法适用于锡/铅共晶、高铅和无铅焊料凸点。该文件讨论了与EM测试相关的优点和问题，以及数据分析的选项。

This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.