Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board (IEC 91/1545/CD:2018); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-803部分:基材和印制板Z轴膨胀的试验方法（IEC 91/1545/CD:2018）；德语和英语文本

2019-05-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (IEC 91/752/CD:2008)
文件草稿.印制板和其他互连结构用材料.第3-1部分:挠性板用覆铜层压板（粘合剂和非粘合剂类型）（IEC 91/752/CD:2008）

2008-05-01

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles (IEC 91/1620/CD:2019); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第5-301部分:印制板组件的试验方法——使用细焊料颗粒的焊膏（IEC 91/1620/CD:2019）；德语和英语文本

2020-12-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 91/1543/CD:2018); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-801部分:基材的热导率试验（IEC 91/1543/CD:2018）；德语和英语文本

2019-04-01

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs (IEC 91/1186/CD:2014)
文件草稿-电气材料、印制板和其他互连结构和组件的试验方法-第3-913部分:高亮度LED用电子电路板导热性的试验方法（IEC 91/1186/CD:2014）

2014-09-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (IEC 91/1749/CD:2021); Text in German and English
文件草稿.印制板和其他互连结构用材料.第2-51部分:包覆和未包覆的增强基材.未包覆的集成电路卡载带用基材（IEC 91/1749/CD:2021）；德语和英语文本

2022-06-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Mater
文件草案.电气材料 印制板和其他互连结构和组件的试验方法.第2-501部分:互连结构材料的试验方法.柔性介质材料的回弹强度和回弹强度保持系数的测量

2020-12-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-805部分:TMA对薄基材的X/Y CTE试验（IEC 91/1696/CD:2020）；德语和英语文本

2022-03-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 91/1546/CD:2018); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-804部分:分层时间试验方法——T260、T288和T300（IEC 91/1546/CD:2018）；德语和英语文本

2019-05-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-808部分:用热瞬态法测定介电层的热阻（IEC 91/1690/CD:2020）；德语和英语文本

2022-03-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-809部分:TMA厚基材的X/Y热膨胀系数试验（CTE）（IEC 91/1747/CD:2021）；德语和英语文本

2022-03-01

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 91/1569/CD:2019); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第5-501部分:材料和组件的一般试验方法——焊剂的表面绝缘电阻（SIR）试验（IEC 91/1569/CD:2019）；德语和英语文本

2019-11-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/744/CD:2007)
文件草稿.文件草稿.印制板和其他互连结构用材料.第2-41部分:包覆和未包覆的增强基材.规定可燃性的包铜溴化环氧纤维素纸/编织E玻璃增强层压板（垂直燃烧试验）

2008-03-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/753/CD:2008)
文件草稿.文件草稿.印制板和其他互连结构用材料.第2-42部分:包覆和未包覆的增强基材.规定可燃性的包铜溴化环氧无纺/编织E玻璃增强层压板（垂直燃烧试验）

2008-04-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/677/CDV:2007); German version prEN 61249-2-34:2007
文件草稿.文件草稿.印制板和其他互连结构用材料.第2-34部分:高频应用的包覆和非包覆增强基材.非卤化改性或未改性树脂系统.规定相对许可度的E玻璃编织层压板

2007-07-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/675/CDV:2007); German version prEN 61249-2-33:2007
文件草案.文件草案.印制板和其他互连结构用材料.第2-33部分:高频应用的包覆和非包覆增强基材.非卤化改性或未改性树脂系统.规定相对许可度的E玻璃编织层压板

2007-07-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/671/CDV:2007); German version prEN 61249-2-31:2007
文件草案.文件草案.印制板和其他互连结构用材料.第2-31部分:高频应用的包覆和非包覆增强基材.卤化改性或未改性树脂系统.规定相对介电常数的编织E玻璃层压板

2007-07-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad (IEC 91/673/CDV:2007); German version prEN 61249-2-32:2007
文件草稿.文件草稿.印制板和其他互连结构用材料.第2-32部分:高频应用的包覆和非包覆增强基材.卤化改性或未改性树脂系统.规定相对介电常数的编织E玻璃层压板

2007-07-01