印制电路和其它内连接结构用材料 第2-10部分:覆铜或不覆铜的增强基材—限定燃烧性(垂直燃烧)的E玻璃纤维布增强改性或不改性溴化环氧及氰酸酯覆铜箔层压板
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad