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现行 IEC TR 63357:2022
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Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles 半导体器件.汽车故障试验方法的标准化路线图
发布日期: 2022-10-11
IEC TR 63357:2022(E)描述了汽车中使用的集成电路故障测试方法的标准化路线图。由于汽车暴露在诸如非常低或高温、振动、高频信号等恶劣环境中。因此,对它们进行测试,以确定可能由恶劣环境引起的故障。有几种故障测试方法及相关问题有待规范。 用于汽车车辆的半导体器件暴露在非常高或非常低的温度、振动、高频信号等恶劣环境中。因此,针对可能由恶劣环境引起的故障进行测试。遵循该故障测试方法的评估结果将提供半导体器件的鲁棒性。
IEC TR 63357:2022(E) describes standardization roadmap of fault test methods for integrated circuits used in automotive vehicles. Since automotive vehicles are exposed in harsh environment such as very low or high temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment. There are several fault test methods and related issues to be standardized.
Semiconductor devices used in automotive vehicles are exposed in harsh environment of very high or very low temperature, vibration, high frequency signals, etc. Therefore, they are tested for possible faults which can be caused by harsh environment Evaluation results following this fault test methods will provide robustness of the semiconductor device.
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归口单位: TC 47
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