本指南阐述了影响高速电路设计的主要因素。考虑因素包括电噪声、电磁干扰、信号传播时间、阻抗、热机械环境保护和散热。取代IPC-D-317A。对IPC-D-317A文件的主要改进包括:嵌入式微带的阻抗模型更新、中心带状线和双带状线几何结构、扩展的EMI布局实践、信号完整性设计约束、增强的图形以及更新的术语和定义。

This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions.