전자 조립품용 부착 재료－제1－3부：전자 납땜 응용에 사용하는 전자등급 땜납합금과 플럭스 및 비플럭스 고형 땜납의 요구사항
电子组装用连接材料第1－3部分:电子焊接用电子级焊料合金及助熔剂和非助熔剂固体焊料的要求

2006-12-18

전자부품 조립용 부착 재료 —제1-3부: 전자부품 솔더링 시 사용하는 전자등급 솔더 합금과 플럭스 및 비플럭스 고체 솔더의 요구사항
电子组装用连接材料.第1-3部分:电子焊接用电子级焊料合金和助焊剂和非助焊剂固体焊料的要求

2021-12-02

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
电子组装用附件材料 - 第1-3部分:电子级焊料合金以及用于电子焊接应用的助焊剂和非助焊剂固体焊剂的要求

2017-12-13

Material for soldering, Part 2: Flux-cored solders
焊接材料第2部分:药芯焊料

1986-05-05

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
使用熔融无铅焊料合金的波峰焊设备腐蚀试验方法 - 第1部分:无表面处理金属材料的侵蚀试验方法

2013-06-18

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
电子组装用连接材料.第1-3部分:电子焊接应用的电子级焊料合金以及助焊剂和非助焊剂固体焊料的要求（IEC 61190-1-3-2017）；德国版本EN IEC 61190-1-3:2018

2018-09-01

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
电子设备连接器 - 测试和测量 - 第12-1部分:焊接测试 - 测试12a:可焊性 润湿 焊锡方法

2006-03-23

Coaxial communication cables - Part 1-305: Mechanical test methods - Solderability and resistance to soldering
同轴通信电缆 - 第1-305部分:机械测试方法 - 可焊性和耐焊接性

2015-08-18

BS EN 62739-1. Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Part 1. Erosion test method for metal materials without surface processing
英国标准EN 62739-1 使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法 第一部分 未经表面处理的金属材料侵蚀试验方法

2012-03-13

Connectors for electronic equipment - Tests and measurements -- Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006).
电子设备用连接器.试验和测量.第12-1部分:焊接试验.试验12a:可焊性 润湿 焊浴法（IEC 60512-12-1-2006）

2007-02-07

Soldering pastes - Part 1: Composition, technical specifications
焊膏.第1部分:成分和技术规范

2005-01-01

Solder paste -- Part 1: Kinds and quality classification
锡膏第1部分:种类和质量分类

2014-01-01

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
使用熔融无铅钎料合金的波峰焊接设备的腐蚀试验方法 - 第2部分:表面处理金属材料的腐蚀试验方法

2016-07-13

Материалы для электронных модулей. Часть 1-1. Требования к паяльным флюсам для высококачественных межсоединений в электронных сборках
电子装配用附件材料第1-1部分:电子装配中高质量互连焊剂的要求

Test method for erosion of wave soldering equipment using molten lead-free solder alloy-Erosion test method for metal materials with surface processing
使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法

2016-10-31

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (IEC 62739-1:2013); German version EN 62739-1:2013
使用熔融无铅焊料合金的波峰焊设备侵蚀试验方法.第1部分:未经表面处理的金属材料侵蚀试验方法（IEC 62739-1-2013）；德文版EN 62739-1:2013

2014-02-01

Test method for erosion of wave soldering equipment using molten lead-free solder alloy-Erosion test method for metal materials without surface processing
使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法

2013-09-30

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
电子组装附件材料 - 第1-1部分:电子组装中高质量互连焊料焊剂的要求

2002-03-25

전자 조립품용 부착 재료－제1－1부：전자기기 조립시 양질의 연결을 위한 땜납 플럭스의 요구사항
电子组装用连接材料第1－1部分:电子组装用高质量互连用焊剂的要求

2006-12-18

전자 조립품용 부착 재료－제1－1부：전자기기 조립시 양질의 연결을 위한 땜납 플럭스의 요구사항
电子组装附件材料第1－1部分:电子组装中高质量互连用焊剂的要求

2006-12-18