Heat Sink, Electrical - Electronic Component, Semiconductor Devices, Formed
散热器 电子电气元件 半导体器件 成型

2012-01-27

Heat Sink, Electrical - Electronic Component, Semiconductor Devices, Extruded
散热器 电气电子元件 半导体器件 挤压

2013-01-31

Heat Sink, Electrical - Electronic Component, Semiconductor Devices, Dual Link
散热器、电气电子元件、半导体器件、双链路

1996-12-01

Heat Sink, Electrical, Electronic Component, Semiconductor Devices, Retainer Clip Type
散热器 电气 电子元件 半导体器件 夹持器类型

2012-09-28

Heat Sink, Electrical - Electronic Component, Semiconductor Devices, Encapsulating Type, To-5
封装型半导体器件电子元件电散热器To-5

1996-12-01

Heat Sink, Electronic Component, Semiconductor Devices, Press-On Type
散热器 电子元件 半导体器件 压入式

2011-06-30

Heat Sink, Electrical - Electronic Component, Semiconductor Devices, for Dual Inline Packages (Dip)
双列直插封装（Dip）用半导体器件电子元件散热器

1995-01-01

HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, CLASS I (FORMED) (S/S BY MIL-H-87111/5C)
I类（成型）半导体器件电气电子元件散热器（MIL-H-87111/5C标准S/S）

1990-05-25

HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, CLASS 1 (FORMED) (SUPERSEDING MIL-H-87111/5B) (S/S BY NAS4121-1996)
1级（成型）电子电气元件半导体器件散热片（取代MIL-H-87111/5B）（由NAS4121-1996提供）

1992-12-11

HEAT SINKS, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, CLASS 1 (FORMED) (SUPERSEDING MIL-H-87111/5B) (S/S BY NAS4121-1996)
半导体器件电子元件散热片 1类（成型）（取代MIL-H-87111/5B）（由NAS4121-1996制成）

2000-11-20