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COMPOUND, INSULATING, ELECTRICAL AND APPLICATION OF (NO S/S DOCUMENT) 化合物、绝缘、电气和应用(无S/S文件)
发布日期: 1988-11-14
分类信息
发布单位或类别: 美国-美国军事规范和标准
关联关系
研制信息
相似标准/计划/法规
现行
MIL MIL-I-46877 Notice 1-Cancellation
INSULATING COMPOUND, ELECTRICAL (NO S/S DOCUMENT)
绝缘化合物 电气(无S/S文件)
1992-03-30
现行
MIL MIL-I-46877
INSULATING COMPOUND, ELECTRICAL (NO S/S DOCUMENT)
电气绝缘化合物(无S/S文件)
1973-12-14
现行
MIL MIL-I-3930/6 Notice 1-Inactivation
INSULATING & JACKETING COMPOUNDS ELECTRICAL(FOR CABLES CORDS & WIRES) INSULATING COMPOUND TYPE IJ-S-MEDIUM-(SBR) (NO S/S DOCUMENT)
绝缘
1990-10-05
现行
MIL MIL-I-3930/6 Notice 2-Cancellation
INSULATING & JACKETING COMPOUNDS ELECTRICAL(FOR CABLES CORDS & WIRES) INSULATING COMPOUND TYPE IJ-S-MEDIUM-(SBR) (NO S/S DOCUMENT)
绝缘和护套化合物电气(用于电缆、电线和电线)绝缘化合物类型IJ-S-中-(SBR)(无S/S文件)
2003-06-26
现行
MIL MIL-I-3930/6
INSULATING & JACKETING COMPOUNDS ELECTRICAL(FOR CABLES CORDS & WIRES) INSULATING COMPOUND TYPE IJ-S-MEDIUM-(SBR) (NO S/S DOCUMENT)
绝缘和护套化合物(用于电缆、电线和电线)绝缘化合物类型IJ-S-MEDIUM-(SBR)(无S/S文件)
1985-06-14
现行
MIL MIL-I-47151 Amendment 1
INSULATING COMPOUND, ELECTRICAL EMBEDDING (NO S/S DOCUMENT) (SUPERSEDING MIS-15711)
绝缘化合物 电子嵌入(无S/S文件)(取代MIS-15711)
1985-07-15
现行
MIL MIL-I-47151
INSULATING COMPOUND, ELECTRICAL EMBEDDING (NO S/S DOCUMENT) (SUPERSEDING MIS-15711)
电气嵌入绝缘化合物(无S/S文件)(代替MIS-15711)
1974-06-07
现行
MIL MIL-I-22266C Amendment 1
INSULATING COMPOUND, ELECTRICAL (FOR FIELD SPLICING APPLICATIONS) (SUPERSEDING MIL-I-22266B) (S/S BY A-A-59296)
绝缘化合物 电气(用于现场应用)(取代MIL-I-22266B)(S/S BY-A-59296)
1973-11-15
现行
MIL MIL-I-22266C Notice 1-Cancellation
INSULATING COMPOUND, ELECTRICAL (FOR FIELD SPLICING APPLICATIONS) (SUPERSEDING MIL-I-22266B) (S/S BY A-A-59296)
电气绝缘化合物(用于现场拼接应用)(取代MIL-I-22266B)(由A-A-59296制成)
1998-07-31
现行
MIL MIL-I-22266C
INSULATING COMPOUND, ELECTRICAL (FOR FIELD SPLICING APPLICATIONS) (SUPERSEDING MIL-I-22266B) (S/S BY A-A-59296)
电气绝缘化合物(用于现场拼接应用)(取代MIL-I-22266B)(S/S由A-A-59296替代)
1971-06-24
现行
MIL MIL-I-3930/4 Notice 1-Inactivation
INSULATING AND JACKETING COMPOUNDS, ELECTRICAL (FOR CABLES, CORDS, AND WIRES), INSULATING COMPOUND, TYPE IR-LOW TEMPERATURE, NATURAL RUBBER (NO S/S DOCUMENT)
绝缘和护套化合物 电气(用于电缆、电线和电线) 绝缘化合物 低温型 天然橡胶(无文件)
1990-10-05
现行
MIL MIL-I-3930/4 Notice 2-Cancellation
INSULATING AND JACKETING COMPOUNDS, ELECTRICAL (FOR CABLES, CORDS, AND WIRES), INSULATING COMPOUND, TYPE IR-LOW TEMPERATURE, NATURAL RUBBER (NO S/S DOCUMENT)
绝缘和护套化合物 电气(用于电缆、电线和电线) 绝缘化合物 低温型 天然橡胶(无文件)
1999-02-23
现行
MIL MIL-I-3930/4
INSULATING AND JACKETING COMPOUNDS, ELECTRICAL (FOR CABLES, CORDS, AND WIRES), INSULATING COMPOUND, TYPE IR-LOW TEMPERATURE, NATURAL RUBBER (NO S/S DOCUMENT)
绝缘和护套化合物 电气(用于电缆、软线和电线) 绝缘化合物 IR-低温型 天然橡胶(无S/S文件)
1985-06-14
现行
MIL MIL-C-83933 Notice 1-Validation
CORROSION PREVENTIVE COMPOUNDS COLD APPLICATION (NO S/S DOCUMENT)
腐蚀预防化合物冷应用(无S/S文件)
1987-02-10
现行
MIL MIL-C-83933
CORROSION PREVENTIVE COMPOUNDS COLD APPLICATION (NO S/S DOCUMENT)
防腐化合物冷敷(无S/S文件)
1967-09-29
现行
QPL QPL-10-112
INSULATING COMPOUND, ELECTRICAL, CERAMIC, CLASS L (SUPERSEDING QPL-10-111) (NO S/S DOCUMENT)
L级陶瓷绝缘化合物(代替QPL-10-111)(无S/S文件)
1998-09-18
现行
QPL QPL-10-112
INSULATING COMPOUND, ELECTRICAL, CERAMIC, CLASS L (SUPERSEDING QPL-10-111) (NO S/S DOCUMENT)
L级陶瓷绝缘化合物(代替QPL-10-111)(无S/S文件)
1998-09-18
现行
MIL MIL-I-10B Notice 1-Cancellation
INSULATING COMPOUND, ELECTRICAL, CERAMIC CLASS L (SUPERSEDING MIL-I-10A) (NO S/S DOCUMENT)
电气绝缘化合物 陶瓷等级L(取代MIL-I-10A)(无S/S文件)
1998-10-27
现行
MIL MIL-I-10B Amendment 4
INSULATING COMPOUND, ELECTRICAL, CERAMIC CLASS L (SUPERSEDING MIL-I-10A) (NO S/S DOCUMENT)
电气绝缘化合物 陶瓷等级L(取代MIL-I-10A)(无S/S文件)
2001-04-24
现行
MIL MIL-I-10B Notice 3-Cancellation
INSULATING COMPOUND, ELECTRICAL, CERAMIC CLASS L (SUPERSEDING MIL-I-10A) (NO S/S DOCUMENT)
电气绝缘化合物 陶瓷等级L(取代MIL-I-10A)(无S/S文件)
2001-04-23