Resin, Polyimide, Laminating High Temperature Resistant, 315 °C (599 °F) (Stabilized: Nov 2016)
耐高温层压聚酰亚胺树脂 315摄氏度(599华氏度)(稳定:2016年11月)
发布日期:
2016-11-16
本规范涵盖单组分、热反应、热固性芳香体系,其热固化形成聚酰亚胺聚合物结构。
This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure.