IEC 60286的这一部分包含了关于引入创新型散装泡罩的信息 小型组件的包装系统，例如尺寸为1005的芯片型组件 （公制）和更小。它包括一个标准化 包装和自动装配系统以及对产品性能的要求 包装材料交叉引用:IEC 60286-3:2019IEC 61340-5-3:2015IEC 62090:2017IEC 61340-5-1:2016购买本文件时可获得的所有现行修改件均包含在购买本文件中。

This part of IEC 60286 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.Cross References:IEC 60286-3:2019IEC 61340-5-3:2015IEC 62090:2017IEC 61340-5-1:2016All current amendments available at time of purchase are included with the purchase of this document.