本规范规定了用于互连芯片组件的有机安装结构的具体要求，这些组件组合形成完整的功能性有机单芯片模块（SCM-L）或有机多芯片模块（MCM-L）组件，以及获取这些组件必须满足的质量和可靠性保证要求。用于IPC-6011。

This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.