BLANK DETAIL SPECIFICATION FOR BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用球栅阵列器件用老化插座空白详细规范

2000-05-01

BLANK DETAIL SPECIFICATION FOR ADAPTOR - CARRIER QUAD FLAT PACK TO PIN GRID ARRAY SOCKETS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用转接器四芯扁平封装到引脚栅极阵列插座空白详细规范

1997-11-06

DETAIL SPECIFICATION NONMECHANICALLY ACTUATED FLEXIBLE CARRIER SOCKETS FOR PIN GRID ARRAY FOR USE IN ELECTRONIC EQUIPMENT
电子设备用针栅阵列用非机械驱动柔性载体插座详细规范

1997-11-06

Detail Specification for Burn-in Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment
电子设备用球栅阵列器件用老化插座详细规范

1997-11-05

DETAIL SPECIFICATION FOR BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用球栅阵列器件用老化插座详细规范

2000-06-01

DETAIL SPECIFICATION FOR NON-MECHANICALLY ACTUATED SOCKETS FOR PIN GRID ARRAY DEVICES WITH 2.54 MM X 2.54 MM (0.1 X 0.1") SPACING FOR USE IN ELECTRONIC EQUIPMENT
电子设备用间距为2.54 MM X 2.54 MM（0.1 X 0.1”）的针栅阵列装置用非机械驱动插座详细规范

1997-11-06

SECTIONAL SPECIFICATION SOCKETS FOR PIN GRID ARRAY DEVICES WITH 2.54MM X 2.54MM (0.1" X 0.1") SPACING FOR USE IN ELECTRONIC EQUIPMENT
电子设备用间距为2.54MM X 2.54MM（0.1“X 0.1”）的针栅阵列器件用插座分规范

1997-11-06

DETAIL SPECIFICATION: MECHANICALLY ACTUATED (ZERO AND LOW INSERTION FORCE) SOCKETS FOR PIN GRID ARRAY DEVICES WITH 2.54 MM X 2.54 MM (0.1" X 0.1") SPACING FOR USE IN ELECTRONIC EQUIPMENT
详细规范:电子设备用间距为2.54 MM X 2.54 MM（0.1“X 0.1”）的针栅阵列装置用机械驱动（零插入力和低插入力）插座

1996-08-01

Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
半导体器件 - 集成电路 - 第2-1部分:数字集成电路 - 双极单片数字集成电路门（不包括未提交的逻辑阵列）的空白详细规范

1991-10-01

半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路（不包括自由逻辑阵列） 空白详细规范
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)

2000-01-03