Detail Specification for Burn-in Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment
电子设备用球栅阵列器件用老化插座详细规范

1997-11-05

DETAIL SPECIFICATION FOR BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用球栅阵列器件用老化插座详细规范

2000-06-01

SECTIONAL SPECIFICATION FOR BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用球栅阵列器件用老化插座分规范

1998-01-01

BLANK DETAIL SPECIFICATION FOR BURN-IN SOCKETS FOR CHIP CARRIER PACKAGES WITH MOLDED CARRIER RINGS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用模制载体环芯片载体封装用老化插座空白详细规范

2001-04-06

DETAIL SPECIFICATION FOR PRODUCTION BALL GRID ARRAY (BGA) SOCKETS WITH 1.27MM (0.050 IN) SPACING FOR USE IN ELECTRONIC EQUIPMENT
电子设备用1.27MM（0.050 IN）间距球栅阵列（BGA）插座生产详细规范

2001-10-01

BLANK DETAIL SPECIFICATION FOR ADAPTOR - CARRIER QUAD FLAT PACK TO PIN GRID ARRAY SOCKETS FOR USE IN ELECTRONIC EQUIPMENT
电子设备用转接器四芯扁平封装到引脚栅极阵列插座空白详细规范

1997-11-06

BLANK DETAIL SPECIFICATION: SOCKETS FOR PIN GRID ARRAY DEVICES WITH 2.54 MM X 2.54 MM (0.1 X 0.1) SPACING FOR USE IN ELECTRONIC EQUIPMENT
空白详细规范:电子设备用间距为2.54 MM X 2.54 MM（0.1 X 0.1）的针栅阵列器件用插座

1997-11-06