首页 馆藏资源 舆情信息 标准服务 科研活动 关于我们
现行 ECA/EIA 540B0AA
到馆提醒
收藏跟踪
购买正版
DETAIL SPECIFICATION FOR PRODUCTION BALL GRID ARRAY (BGA) SOCKETS WITH 1.27MM (0.050 IN) SPACING FOR USE IN ELECTRONIC EQUIPMENT 电子设备用1.27MM(0.050 IN)间距球栅阵列(BGA)插座生产详细规范
发布日期: 2001-10-01
分类信息
关联关系
研制信息
相似标准/计划/法规
现行
ECA/EIA/IS 701
PRODUCTION BALL GRID ARRAY (BGA) SOCKET TEST SPECIFICATION
生产球栅阵列(BGA)插座测试规范
1996-07-01
现行
EIA/IS 701
Production Ball Grid Array (BGA) Socket Test Specification
生产球栅阵列(BGA)插座测试规范
1996-07-01
现行
EIA SP3643
Detail Specification for Burn-in Sockets Used with Ball Grid Array Devices for Use in Electronic Equipment
电子设备用球栅阵列器件用老化插座详细规范
1997-11-05
现行
ECA/EIA 540HAAA
DETAIL SPECIFICATION FOR BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用球栅阵列器件用老化插座详细规范
2000-06-01
现行
ECA/EIA 540HA00
BLANK DETAIL SPECIFICATION FOR BURN-IN SOCKETS USED WITH BALL GRID ARRAY DEVICES FOR USE IN ELECTRONIC EQUIPMENT
电子设备用球栅阵列器件用老化插座空白详细规范
2000-05-01
现行
ECA/EIA 540B0AE
DETAIL SPECIFICATION FOR PRODUCTION LAND GRID ARRAY (LGA) SOCKET FOR USE IN ELECTRONIC EQUIPMENT
电子设备用生产接地网阵列(LGA)插座详细规范
2000-06-01
现行
ECA/EIA SP 4973
DETAIL SPECIFICATION FOR PRODUCTION BALL GRID ARRAY, LOW PIN COUNTSOCKET FOR USE IN ELECTRONIC EQUIPMENT
电子设备用球栅阵列低引脚插座生产详细规范
2002-02-11
现行
EIA SP3935
Detail Specification for Production Land Grid Array (LGA) Socket with 1.27 MM (0.050 IN) Spacing for Use in Electronic Equipment
电子设备用间距为1.27毫米(0.050英寸)的生产用接地栅格阵列(LGA)插座详细规范
1997-10-23