IEC 60384-23:20 23作为IEC 60384-23:20 23 RLV提供，其中包含国际标准及其红线版本，显示了与上一版本相比技术内容的所有变化。IEC 60384-23:20 23适用于固定直流电用表面贴装电容器，具有金属化电极和聚萘二甲酸乙二醇酯电介质，用于电子设备。这些电容器具有金属化的连接垫或焊带，并且旨在直接安装到印刷电路板上或用于混合电路的衬底上。根据使用条件，这些电容器可以具有“自愈特性”。它们主要用于交流分量相对于额定电压较小的应用。IEC 60384的这一部分规定了首选的额定值和特性，选自IEC 60384？1:2021适当的质量评估程序、测试和测量方法，并给出了此类电容器的一般性能要求。参考本部分规范的详细规范中规定的试验严重性和要求具有相同或更高的性能水平。不允许较低的性能水平。用于抑制电磁干扰的电容器不包括在内，但在IEC 60384？14.与上一版相比，这一版包括以下重大技术变化: -此版本相对于上一版本包括以下重大技术变化:基于ISO/IEC指令第2部分:2021对文件的所有部分进行修订，并与其他类似类型的文件进行协调；-文件结构的组织遵循TC 40中确定的新的部分规范结构； -修订表格和第5条，以防止重复和矛盾； -在第5.2款（安装）中，增加了第5.2.1、5.2.2和5.2.3款； -在子条款5.5（剪切试验）中，增加了子条款5.5.1和5.5.2； -在子条款5.14（组分耐溶剂性）中，增加了子条款5.14.1和5.14.2。在表8和表A.2中，组1A和亚组C1中将试验5.14移至5.7.5（最终检查和要求）之前； -在子条款5.15（标记的耐溶剂性）中，增加了子条款5.15.1和5.15.2； -在耐焊接热测试中增加了损耗角正切测量； -包括要求在内的逐批和定期检验表已移至附件A； -修订A1亚组的检查水平（IL）。

IEC 60384-23:2023 is available as IEC 60384-23:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60384-23:2023 is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene naphthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly onto printed boards or onto substrates for hybrid circuits. These capacitors can have "self-healing properties" depending on conditions of use. They are primarily intended for applications where the AC component is small with respect to the rated voltage. This part of IEC 60384 specifies preferred ratings and characteristics, selects from IEC 60384？1:2021 the appropriate quality assessment procedures, tests and measuring methods and gives general performance requirements for this type of capacitor. Test severities and requirements specified in detail specifications referring to this sectional specification are of an equal or higher performance level. Lower performance levels are not permitted. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384？14. This edition includes the following significant technical changes with respect to the previous edition:
- this edition includes the following significant technical changes with respect to the previous edition: revision of all parts of the document based on the ISO/IEC Directives, Part 2:2021, and harmonization with other similar kinds of documents;
- the document structure has been organized to follow new sectional specification structure decided in TC 40;
- revised tables and Clause 5 so as to prevent duplications and contradictions;
- in Subclause 5.2 (Mounting), the Subclauses 5.2.1, 5.2.2 and 5.2.3 have been added;
- in Subclause 5.5 (Shear test), the Subclauses 5.5.1 and 5.5.2 have been added;
- in Subclause 5.14 (Component solvent resistance), the Subclauses 5.14.1 and 5.14.2 have been added. In Table 8 and Table A.2, test 5.14 has been moved before 5.7.5 (Final inspections and requirements) in Group 1A and in Subgroup C1;
- in Subclause 5.15 (Solvent resistance of marking), the Subclauses 5.15.1 and 5.15.2 have been added;
- tangent of loss angle measurement has been added to the resistance to soldering heat test;
- lot-by-lot and periodical inspection tables including requirements have been moved to Annex A;
- revised Inspection Level (IL) of A1 subgroup.