现行

SAE AMS2451/2B

Plating, Brush, Nickel Low Stress, Hard Deposit
电镀、电刷、低应力镍、硬质镀层

2022-10-20

现行

SAE AMS2439A

Selective (Brush) Nickel Plating Low-Stressed, Hard Deposit
选择性（电刷）镀镍低应力硬镀层

2000-10-01

现行

SAE AMS2451/7B

Plating, Brush, Nickel Low Stress, Medium-Hardness Deposit
电镀、电刷、低应力镍、中等硬度镀层

2022-01-21

现行

SAE AMS2451/3D

Plating, Brush, Nickel Low-Stress, Low-Hardness Deposit
低应力低硬度镍镀层、电刷

2022-11-22

现行

SAE AMS2441A

Selective (Brush) Nickel Plating Low-Stressed, Low Hardness Deposit
选择性（电刷）镀镍低应力、低硬度镀层

2000-10-01

现行

SAE AMS2406P

Plating, Chromium Hard Deposit
镀硬铬镀层

2020-12-30

现行

SAE AMS2424G

Plating, Nickel Low-Stressed Deposit
低应力镍镀层

2021-02-26

现行

SAE AMS2451/5C

Plating, Brush, Chromium Hard Deposit, Trivalent
电镀 刷子 硬铬镀层 三价

2021-12-13

现行

SAE AMS2438F

Plating, Chromium Thin, Hard, Dense Deposit
电镀 铬薄 硬 致密沉积物

2021-12-22

现行

SAE AMS2433D

Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition
电镀、镍铊硼或镍硼化学沉积

2020-05-05

现行

MIL MIL-DTL-32648

ZINC NICKEL PLATING, LOW HYDROGEN EMBRITTLEMENT ELECTRO-DEPOSITION
低氢脆电沉积锌镍镀层

2020-03-30

现行

SAE AMS2454A

Plating, Electroless Nickel-Phosphorus, Co-Deposited with Polytetrafluoroethylene (PTFE)
与聚四氟乙烯（PTFE）共沉积的化学镀镍磷镀层

2021-12-21

现行

QJ 1207A-2011

印制板插头镍基底酸性镀硬金技术要求
Technical requirements for nickel-base acid hard gold plating of printed circuit board edge contact

2011-07-19