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Program Management / Systems Engineering Guidelines for Managing the Transition to Lead-Free Electronics 管理无铅电子产品过渡的项目管理/系统工程指南
发布日期: 2006-06-20
本手册旨在帮助项目管理和/或系统工程管理人员管理无铅(无铅)电子产品的过渡,以确保产品的可靠性和性能。如果买方和供应商之间未进行仔细协调,程序可能会无意中引入无铅元素(包括零件表面处理、印制电路板表面处理或组装焊料)。例如,零件制造商可能并不总是更改零件号以识别无铅饰面,尤其是如果之前的锡铅(Sn/Pb)成品零件已停产。 进货检验时对零件和文件的详细检查虽然至关重要,但可能不足以识别无铅零件。
This handbook is designed to assist program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance. Programs may inadvertently introduce Pb-free elements (including piece part finish, printed wiring board finish, or assembly solder) if careful coordination between buyer and supplier is not exercised. For example, piece part manufacturers may not always change part numbers to identify Pb-free finishes, especially if the previous tin-lead (Sn/Pb)-finished piece part has been discontinued. Detailed examination of piece parts and documents at receiving inspection while crucial, may not be sufficient to identify Pb-free piece parts.
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发布单位或类别: 美国-TechAmerica
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