1.1 本规程规定了半导体器件、微电子器件、电磁器件、电子和电气器件以及用于这些项目施工的材料的无损射线照相检查的最低要求。 1.2 本规程涵盖了对这些物品的射线照相检查，以检测密封外壳内可能存在的缺陷，尤其是由于将盖子密封到外壳上而产生的缺陷，以及内部缺陷，例如异物（异物）、不正确的互连导线、模具附合材料或玻璃中的空隙（使用密封玻璃时）、焊接缺陷、，或物理损坏。 1.3 申请依据- 本实践中的某些方面可能需要认可的工程组织和供应商之间的协议，或需要认可的工程组织的具体指导。 这些项目应在采购订单、合同或检验技术中说明。具体应用可能需要部分或全部遵守本惯例。与本规程的偏差应在检验计划中列出，并由认可的工程组织和供应商批准。 1.4 单位- 以英寸-磅为单位的数值应视为标准值。本规程中不包括其他测量单位。 1.5 本标准并非旨在解决与其使用相关的所有安全问题（如有）。本标准的用户有责任在使用前制定适当的安全、健康和环境实践，并确定监管限制的适用性。 1.6 本国际标准是根据世界贸易组织技术性贸易壁垒（TBT）委员会发布的《关于制定国际标准、指南和建议的原则的决定》中确立的国际公认标准化原则制定的。 ====意义和用途====== 4.1 本规程规定了电子设备射线照相检查应用的基本最低参数和控制。讨论了设备处理、设备、ESD、材料、人员资格、程序和质量要求、报告、记录和辐射敏感性等因素。本规程的编写是为了在工程图纸、规范或合同中规定。 这不是一个详细的操作程序，必须由详细的检查技术/程序进行补充（参见 10.1 ). 4.2 本规程未规定辐射剂量限制，但列出了限制和记录设备辐射剂量的要求。当辐射剂量限制是一个问题时，射线照相检查的请求者必须认识到这个问题，并说明使用方之间的合同协议中要求的任何最大辐射剂量限制。

1.1 This practice provides the minimum requirements for nondestructive radiographic examination of semiconductor devices, microelectronic devices, electromagnetic devices, electronic and electrical devices, and the materials used for construction of these items. 1.2 This practice covers the radiographic examination of these items to detect possible defective conditions within the sealed case, especially those resulting from sealing the lid to the case, and internal defects such as extraneous material (foreign objects), improper interconnecting wires, voids in the die attach material or in the glass (when sealing glass is used), solder defects, or physical damage. 1.3 Basis of Application— There are areas in this practice that may require agreement between the cognizant engineering organization and the supplier, or specific direction from the cognizant engineering organization. These items should be addressed in the purchase order, contract, or inspection technique. Specific applications may require adherence to this practice in part or in full. Deviations from this practice shall be enumerated in inspection plan and approved by both cognizant engineering organization and supplier. 1.4 Units— The values stated in inch-pound units are to be regarded as standard. No other units of measurement are included in this practice. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.6 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee. ====== Significance And Use ====== 4.1 This practice establishes the basic minimum parameters and controls for the application of radiographic examination of electronic devices. Factors such as device handling, equipment, ESDS, materials, personnel qualification, procedure and quality requirements, reporting, records and radiation sensitivity are addressed. This practice is written so it can be specified on the engineering drawing, specification, or contract. It is not a detailed how-to procedure and must be supplemented by a detailed examination technique/procedure (see 10.1 ). 4.2 This practice does not set limits on radiation dose but does list requirements to limit and document radiation dose to devices. When radiation dose limits are an issue, the requestor of radiographic examinations must be cognizant of this issue and state any maximum radiation dose limitations that are required in the contractual agreement between the using parties.