IEC 62137-3:20 11描述了用于各种形状和类型的表面安装器件(SMD)、阵列型器件和引线型器件以及使用各种类型的焊料材料合金的引线插入型器件的焊点的可靠性测试的适当测试方法的选择方法。第一版取消并取代了2008年发布的IEC/PAS 62137-3，并包括一些编辑修订。PAS的主要变化包括以下内容: -无技术变更； -一些编辑上的改动和更正； -为了方便起见，一些组成上的改变。

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.