Draft Document - Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 91/519/CD:2005)
文件草稿.表面安装技术.表面安装焊点的环境和耐久性试验方法.第1-1部分:抗拉强度试验（IEC 91/519/CD:2005）

2005-10-01

Draft Document - Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 91/1631/CD:2019); Text in German and English
起草文件-表面安装技术-第2部分:表面安装设备（SMD）的运输和储存条件-应用指南（IEC 91/1631/CD:2019）；德语和英语文本

2020-11-01

Draft Document - Environmental Testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using lead-free solder paste (IEC 91/682/CD:2007)
文件草稿.环境试验.第2-83部分:试验.试验Tf:用无铅焊膏润湿平衡法对表面安装器件（SMD）用电子元件的可焊性试验（IEC 91/682/CD:2007）

2007-09-01