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现行 BS PD IEC TR 62878-2-7:2019
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Device embedding assembly technology-Guidelines. Accelerated stress testing of passive embedded circuit boards 设备嵌入组装技术
发布日期: 2019-04-01
BS PD IEC TR 62878-2-7:2019描述了无源嵌入式电路的加速应力测试 董事会。可用于筛选成品板,包括多层和高密度 互连(HDI)板。这些板主要用于移动设备。交叉引用:IEC 60194购买本文件时提供的所有现行修订均包含在购买本文件中。
BS PD IEC TR 62878-2-7:2019 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.Cross References:IEC 60194All current amendments available at time of purchase are included with the purchase of this document.
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发布单位或类别: 英国-英国标准学会
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