现行

MIL MIL-S-13949/24A

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEMIDE MODIFIED EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/24) (NO S/S DOCUMENT)
基材GM层压印制线路板（编织E玻璃增强、三嗪或双马来酰亚胺改性环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/24）（无S/S文件）

1993-04-11

现行

MIL MIL-S-13949/26A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GM（编织电子玻璃增强材料、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/26A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GM（编织E-玻璃增强、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1993-04-11

现行

MIL MIL-P-13949/21 Notice 1-Cancellation

PLASTIC SHEET, LAMINATED, MATERIALS (FOR PRINTED WIRING BOARDS), BASE MATERIAL, AI, ARAMID, WOVEN, MAJORITY POLYIMIDE, RESIN, PREIMPREGNATED (B-STAGE) (NO S/S DOCUMENT)
塑料片 层压 材料（用于印制线路板） 基材 AI 芳纶 机织 大部分聚酰亚胺 树脂 预浸渍（B级）（无S/S文件）

1994-01-25

现行

MIL MIL-S-13949/10C Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/10B) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GI（编织电子玻璃增强材料、聚酰亚胺树脂、耐热、金属包覆或非包覆）（取代MIL-S-13949/10B）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/10C

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN, HEAT RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/10B) (NO S/S DOCUMENT)
基材GI层压印刷线路板（编织E玻璃增强、聚酰亚胺树脂、耐热、金属包覆或非包覆）（替代MIL-S-13949/10B）（无S/S文件）

1993-08-06

现行

BS EN 61249-2-26-2005

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2005-10-07

现行

BS EN 61249-2-6-2003

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料 加固基材 包覆和未包覆 规定可燃性的包铜溴化环氧无纺/编织E玻璃纤维增强层压板（垂直燃烧试验）

2006-08-31

现行

MIL MIL-S-13949/13C Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GI（编织电子玻璃增强材料、聚酰亚胺树脂）（取代MIL-S-13949/13B）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/13C Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GI（编织电子玻璃增强材料、聚酰亚胺树脂）（取代MIL-S-13949/13B）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/13C

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GI（编织E玻璃增强、聚酰亚胺树脂）（替代MIL-S-13949/13B）（无S/S文件）

1993-08-06

现行

MIL MIL-S-13949/4D Amendment 1

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/4C) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃 金属包覆或未包覆）（取代MIL-S-13949/4C）（无S/S文件）

1996-01-26

现行

MIL MIL-S-13949/29A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/29) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GC（编织电子玻璃增强材料 多数氰酸酯树脂 阻燃 金属包覆或非包覆）（取代MIL-S-13949/29）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/4D Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/4C) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃 金属包覆或未包覆）（取代MIL-S-13949/4C）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/29A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/29) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GC（编织电子玻璃增强材料 多数氰酸酯树脂 阻燃 金属包覆或非包覆）（取代MIL-S-13949/29）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/4D Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/4C) (NO S/S DOCUMENT)
层压印刷线路板片材 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃 金属包覆或未包覆）（取代MIL-S-13949/4C）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/4D

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/4C) (NO S/S DOCUMENT)
基材GF层压印刷线路板（编织E玻璃增强 多数双功能环氧树脂 阻燃 金属包覆或未包覆）（替代MIL-S-13949/4C）（无S/S文件）

1993-08-16

现行

MIL MIL-S-13949/29A

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GC (WOVEN E-GLASS REINFORCEMENT, MAJORITY CYANATE ESTER RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/29) (NO S/S DOCUMENT)
基材GC层压印刷线路板（编织E玻璃增强 多数氰酸酯树脂 阻燃 金属包覆或非包覆）（替代MIL-S-13949/29）（无S/S文件）

1993-05-18

现行

BS EN 61249-2-22-2005

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2005-08-24

现行

BS EN 61249-2-21-2003

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2004-02-16