数字微电子器件封装的串扰特性测试方法
Crosstalk test method for digital microelectronic device packages

2018-02-09

微电子器件测试系统自检模块校准规范
Calibration Specification of Self - checking Modules for Microelectronic Devices Testing Systems

2019-11-11

微电子器件封装的地和电源阻抗测试方法
Ground and power supply impedance test method for microelectronics device packages

2018-02-09

초소형 전자 부품의 정전 방전에 견딜 수 있는 임계값에 대한 전계 유도 하전 소자 모델의 시험 방법
用于静电放电场感应带电装置模型试验方法承受微电子元件的阈值

2002-12-31

Preconditioning of Non-Hermetic Surface Mount Devices Prior to Reliability Testing
可靠性测试前非密封表面安装装置的预处理

2003-02-01

Semiconductor devices. Mechanical and climatic test methods-Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件 机械和气候试验方法

2020-09-30

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件 - 机械和气候测试方法 - 第30部分:在可靠性测试之前对非密封性表面贴装器件进行预处理

2020-08-17

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件.机械和气候试验方法.第30部分:可靠性试验前非密封表面安装器件的预处理

2020-08-17

Semiconductor devices - Mechanical and climatic test methods -- Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
半导体器件机械和气候试验方法第30部分:可靠性试验前非密封表面安装器件的预处理

2005-11-02

半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

2018-09-17

Aerospace series. Elements of electrical and optical connection. Test methods-Optical elements. Thermal shock (Hermetically sealed devices)
航空航天系列 电气和光学连接元件 测试方法

2002-07-15

Aerospace series - Elements of electrical and optical connection; Test methods - Part 6323: Optical elements; Thermal shock (hermetically sealed devices); German version EN 2591-6323:2002
航空航天系列.电气和光学连接件；试验方法.第6323部分:光学元件；热冲击（密封装置）；德文版EN 2591-6323:2002

2002-12-01