IEC 60317-55:2013+A1:2019规定了180级双涂层可焊接漆包圆铜绕组线的要求。底层涂层基于聚氨酯树脂，只要其保留原始树脂的化学特性并满足所有规定的电线要求，就可以对其进行改性。叠加涂层基于聚酰胺树脂。 注-改性树脂是经过化学变化的树脂，或含有一种或多种添加剂以增强某些性能或应用特性的树脂。本标准涵盖的公称导体直径范围如下: -1级:0,020 mm至1,600 mm并包括1,600 mm； -2级:0,020毫米至1,600毫米（含1,600毫米）。IEC 60317-0-1第4条规定了标称导体直径:2013.这第二版取消并取代了2007年出版的第一版。本版构成技术修订版。与上一版相比，此版本包括以下重大技术变更: -修订第23条，针孔测试。关键词:可焊漆包圆铜绕组线要求，180级，双涂层 该合并版本由第二版（2013年）及其修正案1（2019年）组成。因此，除本出版物外，无需下令修订。 本出版物应与IEC 60317-0-1:20 13一起阅读。

IEC 60317-55:2013+A1:2019 specifies the requirements of solderable enamelled round copper winding wire of class 180 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is based on polyamide resin.
NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is as follows:
- Grade 1: 0,020 mm up to and including 1,600 mm;
- Grade 2: 0,020 mm up to and including 1,600 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 2007. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- revision to Clause 23, Pin hole test. Keywords: requirements of solderable enamelled round copper winding wire, class 180, dual coating
This consolidated version consists of the second edition (2013) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.
This publication is to be read in conjunction with IEC 60317-0-1:2013.