석고판용 원지
原纸石膏板

2018-12-31

涂布纸和纸板 第6部分：水性涂布纸
Coated paper and board—Part 6: Water-based coated paper

2023-12-28

Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
印制板用无纺纤维素基纸的规范和表征方法

1998-08-01

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
印制线路板用覆铜层压板纸基环氧树脂

1997-01-01

Pulp, paper and board. Microbiological examination-Enumeration of bacteria and bacterial spores based on disintegration
纸浆、纸张和纸板 微生物检查 基于解体的细菌和细菌孢子计数

2014-12-31

Pulp, paper and board — Microbiological examination — Part 3: Enumeration of yeast and mould based on disintegration
纸浆、纸和纸板.微生物检验.第3部分:基于崩解的酵母和霉菌计数

2022-04-26

펄프, 종이 및 판지 — 미생물학적 시험 — 제1부: 해리에 기초한 박테리아 및 박테리아 포자의 계수
纸浆、纸和纸板.微生物学检验.第1部分:基于分解的细菌和细菌孢子计数

2022-12-22

Pulp, paper and board — Microbiological examination — Part 1: Enumeration of bacteria and bacterial spores based on disintegration
纸浆和纸板 - 微生物检验 - 第1部分:基于分解的细菌和细菌孢子的计数

2014-11-24

종이 및 판지 - 미생물학적 분석 - 제1부 : 해리된 시료의 박테리아, 효모 및 곰팡이 총수
纸和纸板微生物检验第1部分:基于崩解的细菌、酵母和霉菌总数

2016-03-21

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
印制板和其他互连结构用材料

2005-08-09

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
印制板和其他互连结构用材料

2006-06-30

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
印制板和其他互连结构用材料

2005-08-25

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
印刷电路板及其他互连结构材料 - 第2-1部分:增强基材 包层和不包覆 - 酚醛纤维素纸增强层压板 经济级铜包层

2005-01-11

인쇄 회로 기판 및 기타 연결 구조 재료－제2－1부：동박 및 무동박 보강재－셀룰로오스 종이 기재 페놀 수지 동박 적층판, 경제적 등급
印制板和其他互连结构用材料第2－1部分:包层和非包层增强基材经济级包铜酚醛纤维素纸增强层压板

2006-12-26

인쇄 회로 기판 및 기타 연결 구조 재료－제2－1부：동박 및 무동박 보강재－셀룰로오스 종이 기재 페놀 수지 동박 적층판, 경제적 등급
印制板和其他互连结构用材料第2－1部分:包层和非包层增强基材经济级包铜酚醛纤维素纸增强层压板

2006-12-26

회로기판 및 다른 내부 접속용 구조를 위한 재료 — 제2-2부: 강화 원자재, 덮임 및 비덮임 — 페놀수지를 적용한 셀룰로오스 종이 강화 시트, 고전기 등급, 동박 적층
印制板和其他互连结构用材料第2-2部分:覆层和非覆层增强基材覆铜高电气级酚醛纤维素纸增强层压板

2022-06-28

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
印刷电路板及其他互连结构材料 - 第2-2部分:强化基材 包层和不包覆 - 酚醛纤维素纸加强复合板 高电级 铜包层

2005-01-20

Материалы для печатных плат и других структур межсоединений. Часть 2-2. Материалы основания армированные фольгированные и нефольгированные. Листы армированные слоистые на основе целлюлозной бумаги, пропитанной фенольным связующим, фольгированные медью и обладающие высокими электрическими характеристиками
印刷板和其他互连结构的材料 第2-2部分 加强基材 包覆和不包括 酚醛纤维素纸增强层压板 铜包层和高电级

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
印刷电路板及其他互连结构材料 - 第2-23部分:强化基材 包覆和非包覆 - 非卤化酚醛纤维素纸加强复合板 经济级铜包层

2005-01-11