CAPACITORS, FIXED, CERAMIC, CHIP, HIGH FREQUENCY
高频片式陶瓷固定电容器

2006-07-12

CAPACITORS, FIXED, CERAMIC, CHIP, HIGH FREQUENCY
高频片式陶瓷固定电容器

2006-07-12

CAPACITORS, FIXED, CERAMIC, CHIP, HIGH VOLTAGE(SUPERSEDING DSCC 89089A)
片式高压固定陶瓷电容器（取代DSCC 89089A）

2006-04-10

Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, Size 0603
0603尺寸 扩展范围 高可靠性和标准可靠性 固定式陶瓷电介质芯片电容器（温度稳定和通用）

2020-02-14

Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, Size 0603
0603尺寸 扩展范围 高可靠性和标准可靠性 固定式陶瓷电介质芯片电容器（温度稳定和通用）

2018-01-31

Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, Size 0603
0603尺寸 扩展范围 高可靠性和标准可靠性 固定式陶瓷电介质芯片电容器（温度稳定和通用）

2017-07-31

Capacitor, Chip, Fixed, Ceramic Dielectric (Temperature Stable and General Purpose), Extended Range, High Reliability and Standard Reliability, Size 0603
陶瓷介质（温度稳定且通用）固定式片式电容器 扩展范围 高可靠性和标准可靠性 尺寸0603

2015-09-28

Capacitors, Chip, Single Layer, Fixed Unencapsulated, Ceramic Dielectric, Established Reliability, Style CPCR01 (High Frequency)
CPCR01型（高频）陶瓷电介质固定式单层芯片电容器

2016-03-22

Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Styles CDR11, CDR12, CDR13, and CDR14 (High Frequency)
电容器 芯片 多层 固定 陶瓷电介质 已建立的可靠性和未建立的可靠性 CDR11、CDR12、CDR13和CDR14型（高频）

2020-03-03

Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Styles CDR11, CDR12, CDR13, and CDR14 (High Frequency)
电容器 芯片 多层 固定 陶瓷介质 既有可靠性也有非既有可靠性 型号CDR11 CDR12 CDR13和CDR14（高频）

2015-03-25

Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Styles CDR21, CDR22, CDR23, CDR24, and CDR25 (High Frequency)
电容器 芯片 多层 固定 陶瓷电介质 已建立的可靠性和未建立的可靠性 CDR21、CDR22、CDR23、CDR24和CDR25型（高频）

2011-10-20

Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Styles CDR21, CDR22, CDR23, CDR24, and CDR25 (High Frequency)
电容器 芯片 多层 固定 陶瓷电介质 已建立的可靠性和未建立的可靠性 CDR21、CDR22、CDR23、CDR24和CDR25型（高频）

2016-07-26

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CDR21, CDR22, CDR23, CDR24, AND CDR25 (HIGH FREQUENCY)(SUPERSEDING MIL-PRF-55681/5D)
固定陶瓷介质多层片式电容器 既有可靠性也有非既有可靠性 型号CDR21、CDR22、CDR23、CDR24和CDR25（高频）（取代MIL-PRF-55681/5D）

2006-10-10

CAPACITORS, CHIP, SINGLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLE CPCR01 (HIGH FREQUENCY) (NO S/S DOCUMENT) (S/S BY MIL-C-49464/1A)
电容器 芯片 单层 固定不动 陶瓷电介质 建立可靠性 样式CPCR01（高频）（无S/S文件）（MIL-C-49464/1A的S/S）

1989-03-22

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR11, CDR12, CDR13, AND CDR14 (HIGH FREQUENCY) (S/S BY MIL-C-55681/4C)
多层固定无封装陶瓷介质芯片电容器 可靠性高 CDR11、CDR12、CDR13和CDR14（高频）（MIL-C-55681/4C标准S/S）

1985-10-07

CAPACITORS, CHIP, SINGLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLE CPCR01 (HIGH FREQUENCY) (NO S/S DOCUMENT) (S/S BY MIL-C-49464/1A)
CPCR01（高频）型单层固定无封装陶瓷介质片式电容器（无S/S文件）（MIL-C-49464/1A提供的S/S）

1988-05-12

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CDR11, CDR 12, CDR13 AND CDR14 (HIGH FREQUENCY) (SUPERSEDING MIL-C-55681/6) (NO S/S DOCUMENT)
电容器 芯片 多层 固定 陶瓷电介质 已建立的可靠性和未建立的可靠性 型号CDR11 cdr12 CDR13和CDR14（高频）（取代MIL-C-55681/6）（无S/S文件）

2000-12-15

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CDR11, CDR 12, CDR13 AND CDR14 (HIGH FREQUENCY) (SUPERSEDING MIL-C-55681/6) (NO S/S DOCUMENT)
固定陶瓷介质多层片式电容器 既有可靠性也有非既有可靠性 型号CDR11、CDR12、CDR13和CDR14（高频）（取代MIL-C-55681/6）（无S/S文件）

1997-07-03