现行

MIL MIL-PRF-49464/1C Notice 1-Validation 1

Capacitors, Chip, Single Layer, Fixed Unencapsulated, Ceramic Dielectric, Established Reliability, Style CPCR01 (High Frequency)
CPCR01型（高频）陶瓷电介质固定式单层芯片电容器

2016-03-22

现行

DOD DOD-C-55681/11

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR35 METRIC
已确立可靠性的陶瓷介质多层固定无封装片式电容器CDR35公制

1983-08-25

现行

SJ 20318-1993

ＣＣＫ４１０３型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CCK4103

1993-05-11

现行

SJ 20314-1993

ＣＴＫ４１０４型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4104

1993-05-11

现行

SJ 20313-1993

ＣＴＫ４１０３型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4103

1993-05-11

现行

SJ 20312-1993

ＣＴＫ４１０２型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4102

1993-05-11

现行

SJ 20311-1993

ＣＣＫ４１０４型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CCK4104

1993-05-11

现行

SJ 20203-1992

ＣＴＫ４１０１型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability, Type CTK4101

1992-11-19

现行

DOD DOD-C-55681/9

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR33 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR33公制（无S/S文件）

1983-08-25

现行

DOD DOD-C-55681/8

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR32 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR32公制（无S/S文件）

1983-08-25

现行

DOD DOD-C-55681/10

CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR34 METRIC(NO S/S DOCUMENT)
固定式、非封装陶瓷介质多层片式电容器 已确立的可靠性类型CDR34公制（无S/S文件）

1983-08-25

现行

MIL MIL-PRF-49464C Amendment 1

Capacitors, Chip, Single Layer, Fixed, Parallel Plate, Ceramic Dielectric, Established Reliability, General Specification for
已确定可靠性的陶瓷电介质单层固定平行板片式电容器通用规范

2017-07-28

现行

MIL MIL-C-49464/1 Amendment 1

CAPACITORS, CHIP, SINGLE LAYER, FIXED UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLE CPCR01 (HIGH FREQUENCY) (NO S/S DOCUMENT) (S/S BY MIL-C-49464/1A)
电容器 芯片 单层 固定不动 陶瓷电介质 建立可靠性 样式CPCR01（高频）（无S/S文件）（MIL-C-49464/1A的S/S）

1989-03-22

现行

MIL MIL-C-55681D

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确立可靠性的多层固定无封装陶瓷介质片式电容器（取代MIL-C-55681C）（由MIL-PRF-55681E提供）

1994-07-13

现行

MIL MIL-C-55681D Supplement 1

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确定可靠性的多层固定、未封装陶瓷电介质芯片电容器（取代MIL-C-55681C）的通用规范

1994-07-13

现行

MIL MIL-C-55681/6

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR26, CDR27, CDR28, CDR29, AND CDR30 (S/S BY MIL-PRF-55681/6A)
电容器 片式 多层 固定 未封装 陶瓷介质 可靠 型号CDR26 CDR27 CDR28 CDR29和CDR30（S/S由MIL-PRF-55681/6A提供）

1981-07-30

现行

MIL MIL-C-55681/6 Notice 1-Validation

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR26, CDR27, CDR28, CDR29, AND CDR30 (S/S BY MIL-PRF-55681/6A)
电容器 芯片 多层 固定 未封装 陶瓷电介质 建立可靠性 样式CDR26 CDR27 CDR28 CDR29和CDR30（S/S BY MIL-PRF-55681/6A）

1989-06-05

现行

MIL MIL-C-55681/6 Amendment 1

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR26, CDR27, CDR28, CDR29, AND CDR30 (S/S BY MIL-PRF-55681/6A)
电容器 芯片 多层 固定的 未封装的 陶瓷电介质 已建立的可靠性 型号CDR26 CDR27 CDR28 CDR29和CDR30（由MIL-PRF-55681/6A制成）

1991-04-01

现行

MIL MIL-PRF-55681/13

Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR37
电容器 芯片 多层 固定 陶瓷介质 既有可靠性和非既有可靠性 CDR37型

2016-07-12

现行

MIL MIL-PRF-55681/12

Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR36
电容器 芯片 多层 固定 陶瓷介质 既有可靠性和非既有可靠性 CDR36型

2016-07-12