现行

CID A-A-3053

ADHESIVE, EPOXY RESIN BASE, GENERAL PURPOSE (SUPERSEDING MMM-A-187) (NO S/S DOCUMENT)
通用环氧树脂基胶粘剂（替代MMM-A-187）（无S/S文件）

1996-08-06

现行

FED MMM-A-187B

ADHESIVE, EPOXY RESIN BASE LOW AND INTERMEDIATE STRENGTH, GENERAL PURPOSE (S/S BY A-A-3053) (SUPERSEDING MMM-A-187A)
通用中低强度环氧树脂基胶粘剂（S/S BY A-A-3053）（替代MMM-A-187A）

1974-09-11

现行

MIL MIL-P-22324A

PLASTIC SHEET, LAMINATED, THERMOSETTING, PAPER-BASE, EPOXY-RESIN (SUPERSEDING MIL-P-22324) (S/S BY MIL-I-24204A)
纸基环氧树脂热固性层压塑料板（取代MIL-P-22324）（由MIL-I-24204A提供）

1962-04-03

现行

MIL MIL-P-18177C Amendment 2

PLASTIC SHEET, LAMINATED, THERMOSETTING, GLASS FIBER BASE, EPOXY-RESIN (S/S BY MIL-I-24768/2 AND MIL-I-24768/3) (SUPERSEDING MIL-P-18177B)
玻璃纤维基热固性环氧树脂层压塑料板（S/S由MIL-I-24768/2和MIL-I-24768/3修订）（取代MIL-P-18177B）

1986-09-17

现行

MIL MIL-S-13949/16B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材AF（编织芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/16A）（无S/S文件）

1993-03-28

现行

MIL MIL-S-13949/23B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/23A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材BF（非织造芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/23A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/16B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/16B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/11B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GE（编织E-玻璃增强、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1994-06-06

现行

MIL MIL-S-13949/22B

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
基材BF层压印刷线路板（非纺织芳纶增强、环氧树脂、金属包覆或非包覆）（替代MIL-S-13949/22A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/11B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GE（编织电子玻璃增强材料、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/22B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/22B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/26A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GM（编织E-玻璃增强、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1993-04-11

现行

MIL MIL-S-13949/25B

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL CF (NONWOVEN POLYESTER, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/25A) (NO S/S DOCUMENT)
基材CF层压印刷线路板板材（无纺聚酯、环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/25A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/26A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GM（编织电子玻璃增强材料、三嗪和/或双马来酰亚胺改性环氧树脂）（取代MIL-S-13949/26）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/25B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL CF (NONWOVEN POLYESTER, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/25A) (NO S/S DOCUMENT)
层压印刷线路板薄板 基材CF（无纺聚酯、环氧树脂、阻燃、金属包覆或非包覆）（取代MIL-S-13949/25A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/15C

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/15B) (NO S/S DOCUMENT)
基材AF层压印刷线路板（编织芳纶增强、环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/15B）（无S/S文件）

1993-03-28

现行

MIL MIL-S-13949/12B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/12A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GF（编织E-玻璃增强、多数双功能环氧树脂、阻燃）（替代MIL-S-13949/12A）（无S/S文件）

1993-08-16

现行

MIL MIL-S-13949/12B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GF (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/12A) (NO S/S DOCUMENT)
片材 印刷线路板 预浸料 基材GF（编织电子玻璃增强材料 多数双功能环氧树脂 阻燃）（取代MIL-S-13949/12A）（无文件）

1997-08-01