Test Methods and Procedures for Solid State Devices: Solderability
固态器件的试验方法和程序:可焊性

1998-09-02

Test Methods and Procedures for Solid State Devices: Temperature Cycling
固态器件的试验方法和程序:温度循环

1989-12-01

Test Methods and Procedures for Solid State Devices - Mechanical Shock
固态器件的试验方法和程序.机械冲击

2001-03-01

Test Methods and Procedures for Solid State Devices - Test Method B105-A Lead Integrity
固态器件的试验方法和程序.试验方法B105-A导线完整性

1999-01-01

Test Methods and Procedures for Solid State Devices: Accelerated Moisture Resistance - Unbiased Autoclave
固态器件的试验方法和程序:加速抗湿性.无偏高压釜

1991-03-01

Test Methods and Procedures for Solid State Devices - Cycled Temperature-Humidity-Bias Life Test
固态器件的试验方法和程序.循环温湿度偏置寿命试验

2000-04-20

Test Methods and Procedures for Solid State Devices: Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices
固态器件的试验方法和程序:塑料表面安装器件的湿致应力敏感性

1995-11-01

Test Methods and Procedures for Solid State Devices - Test Method B106-B, Resistance to Soldering Temperature for Through-Hole Mounted Devices
固态器件的试验方法和程序.通孔安装器件的耐焊接温度试验方法B106-B

1999-02-01

Test Methods and Procedures for Solid State Devices - Test Method A110-B, High Accelerated Temperature and Humidity Stress Test (HAST)
固态器件的试验方法和程序.试验方法A110-B 高加速温度和湿度应力试验（HAST）

1999-02-01