本文件适用于军用和商用航空航天市场设备电子材料和工艺的集成和管理计划的制定；以及其他希望使用本文件的ADHP市场。如本文件所述，电子材料和工艺的示例包括焊接合金、电镀饰面、散装金属、底盘材料和饰面、用于机械零件的材料，等等。对于计划负责人来说，审查和了解与应用能力有关的所有“收到时”或“现成”电子材料的属性和配置控制至关重要，以便识别风险，并在必要时采取额外措施来缓解风险。技术要求见本标准第3节，管理要求见第4节。

This document applies to the development of Plans for integrating and managing electronic materials and processes for equipment in the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document.Examples of electronic materials and processes, as described in this document, include soldering alloys, plating finishes, bulk metals, chassis materials and finishes, materials used for mechanical parts, etc.It is critical for the Plan owner to review and understand the properties and configuration control of all “as-received” or “off the-shelf” electronic materials with respect to the application capabilities in order to identify risks, and where necessary, take additional action to mitigate the risks.The technical requirements are in Section 3 of this standard, and the administrative requirements are in Section 4.