本文件适用于军用和商用航空航天市场设备中电子元件的集成和管理计划的制定；以及其他希望使用本文件的ADHP市场。如本文件所述，电子元件的示例包括电阻器、电容器、二极管、集成电路、混合电路、专用集成电路、绕线元件和继电器。对于计划负责人来说，审查和理解所有“接收时”电子元件的设计、材料、配置控制和鉴定方法，以及它们在应用方面的能力至关重要； 识别风险，并在必要时采取额外措施来降低风险。技术要求见本标准第3条，管理要求见第4条。

This document applies to the development of Plans for integrating and managing electronic components in equipment for the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document.Examples of electronic components, as described in this document, include resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits, wound components, and relays.It is critical for the Plan owner to review and understand the design, materials, configuration control, and qualification methods of all “as-received” electronic components, and their capabilities with respect to the application; identify risks, and where necessary, take additional action to mitigate the risks.The technical requirements are in Clause 3 of this standard, and the administrative requirements are in Clause 4.