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现行 IEC 60317-35:2013+AMD1:2019+AMD2:2024 CSV
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Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer 特种绕组线规范第35部分:带粘合层的155级可焊接聚氨酯漆包圆铜线
发布日期: 2024-06-14
IEC 60317-35:2013+AMD1:2019+AMD2:2024 CSV规定了双涂层155级可焊接漆包圆铜绕组线的要求。底层涂层基于聚氨酯树脂,只要保留原始树脂的化学特性并满足所有规定的电线要求,就可以对其进行改性。叠加涂层是基于热塑性树脂的粘合层。 注-改性树脂是经过化学变化的树脂,或含有一种或多种添加剂以增强某些性能或应用特性的树脂。本标准涵盖的公称导体直径范围为: -1B级:0,020 mm至0,800 mm并包括0,800 mm; -2B级:0,020 mm至0,800 mm。IEC 60317第4条规定了标称导体直径-0-1:2013.这第二版取消并取代了1992年出版的第一版,修正案1:19 97和修正案2:19 99。本版构成技术修订版。与上一版相比,此版本包括以下重大技术变更: -新的3.2.2载有关于绕组线的一般说明,以前是范围的一部分; -修订IEC 60317-0-1:20 13的参考文献,以阐明其应用是规范性的; -修改条款15以删除特定的导线样本尺寸; -合并17.1和17.2的可焊性要求; -新订的第23条,针孔测试。 关键词:可焊漆包圆铜绕组线要求,155级,双涂层
IEC 60317-35:2013+AMD1:2019+AMD2:2024 CSV specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin.
NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:
- Grade 1B: 0,020 mm up to and including 0,800 mm;
- Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- modification to Clause 15 to remove specific wire specimen sizes;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- new Clause 23, Pin hole test.

Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating
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归口单位: TC 55
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