MIL MIL-HDBK-1861B-电气和电子组件、电路板、卡和相关硬件的选择和使用-国家数字标准馆

现行 MIL MIL-HDBK-1861B

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Selection and Use of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware 电气和电子组件、电路板、卡和相关硬件的选择和使用

发布日期： 2013-10-18

本手册仅供参考，不能作为要求引用。如果是，承包商不必遵守。本手册包括以下内容:a.选定的标准项目，用于国防部管辖范围内的国防部设备的设计和制造。b、 国防部装备中使用物品的选择和应用指南。

This handbook is for guidance only and cannot be cited as a requirement. If it is, the contractor does not have to comply. This handbook consists of the following: a. Selected standard items, for use in the design and manufacturer of Department of Defense equipment under the jurisdiction of the Department of Defense. b. Guides for the choice and application of items for use in Department of Defense equipment.

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发布单位或类别：美国-美国军事规范和标准

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相似标准/计划/法规

MIL MIL-HDBK-1861B Change 1(change incorporated)

Selection and Use of Electrical and Electronic Assemblies, Boards, Cards, and Associated Hardware
电气和电子组件、板、卡和相关硬件的选择和使用

MIL MIL-HDBK-1861 Notice 1-Validation

SELECTION AND USE OF ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE (S/S BY MIL-HDBK-1861A)
电气和电子组件、板、卡和相关硬件的选择和使用（由MIL-HDBK-1861A提供）

MIL MIL-STD-1861A Notice 1-Cancellation

ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE, SELECTION AND USE OF (SUPERSEDING MIL-STD-1861) (S/S BY MIL-HDBK-1861)
电气和电子组件、板、卡和相关硬件（取代MIL-STD-1861）的选择和使用

MIL MIL-STD-1861A

ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE, SELECTION AND USE OF (SUPERSEDING MIL-STD-1861) (S/S BY MIL-HDBK-1861)
电气和电子组件、电路板、卡和相关硬件的选择和使用（取代MIL-STD-1861）（S/S由MIL-HDBK-1861提供）

BS EN IEC 61191-1-2018

Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件

IEC 61191-1-2018 RLV

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

IEC 61191-1-2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

KS C IEC 61191-1(2016 Confirm)

인쇄기판 조립품－제1부：품목규격：표면실장 및 관련 조립기술을 이용하여 납땜된 전기전자 조립품에 대한 요구사항
印制板组件第1部分:总规范采用表面安装和相关组装技术的焊接电气和电子组件的要求

KS C IEC 61191-1

인쇄회로기판 조립품 —제1부: 일반규격 — 표면실장 및 관련 실장기술을 이용하여 솔더링한 전기전자 조립품에 대한 요구사항
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求

GB/T 19247.1-2003

印制板组装第1部分:通用规范采用表面安装和相关组装技术的电子和电气焊接组装的要求
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

BS 11/30255124 DC

BS EN 61191-1. Printed board assemblies. Part 1. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
BS EN 61191-1 印制板组件第一部分通用规范使用表面安装和相关组装技术的焊接电气和电子组件的要求

DIN EN IEC 61191-1

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求（IEC 61191-1-2018）；德文版EN IEC 61191-1:2018

《国家标准化发展纲要》提出建设国家数字标准馆，推动标准化工作向数字化、网络化、智能化转型。中国标准化研究院正在全力推进国家数字标准馆建设，力争在2026年底建成“一个中心”和“一个平台”，即全球领先的标准数据资源中心，涵盖标准全生命周期的数字化、网络化、智能化研究与服务平台。

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