IEC 61191-1:20 18 RLV包含国际标准及其红线版本。红线版本只有英文版本。Redline版本为您提供了一种快速简单的方法来比较该标准与其前一版本之间的所有变化。红线版本不是IEC官方标准，只有标准的当前版本才被视为官方文件。 IEC 61191-1:20 18规定了使用表面贴装和相关组装技术生产高质量焊接互连和组件的材料、方法和验证标准的要求。IEC 61191的这一部分还包括良好制造工艺的建议。与上一版相比，此版本包括以下重大技术变更:-已更新要求以符合IPC中的可接受标准？A-610F; -术语“装配图”已全部改为“装配文件”； -更正了对IEC标准的引用； -第9条完全重写； -删除附件B，因为已经有电路板组装的程序。

IEC 61191-1:2018 RLV contains the International Standard and its Redline version. The Redline version is available in English only. The Redline version provides you with a quick and easy way to compare all the changes between this standard and its previous edition. The Redline version is not an official IEC Standard, only the current version of the standard is to be considered the official document.

IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC？A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.