Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件
BS EN IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria
for producing quality soldered interconnections and assemblies using surface mount and
related assembly technologies. This part of IEC 61191 also includes recommendations for
good manufacturing processes.Cross References:IEC 61191-4IPC-A-610EN 61191-4IEC 61191-2EN 61190-1-1IEC 61249-8-8IEC 61340-5-1EN 60068-2-58IEC/TR 61340-5-2IEC 60068-2-20IEC 61189-1CLC/TR 61340-5-2IEC 61190-1-3EN 61191-2EN 61249-8-8IEC 60721-3-1IEC 61191-3EN 61189-1IEC 60068-2-58EN 61191-3IEC 61189-3EN 60068-2-20IEC 60194EN IEC 60721-3-1EN 61340-5-1EN 61760-2IEC 61760-2EN IEC 61190-1-3EN 61189-3ISO 9001:2008IEC 61190-1-1J-STD-033IEC 61188-5-6EN 61188-5-5EN 62326-1IPC-SM-817IEC 61188-5-2EN 61189-2IPC-9191J-STD-003IEC/PAS 62326-7-1IEC 61189-2IEC 61193-3EN 61190-1-2EN 62326-4EN 61188-5-1EN 61188-5-4J-STD-005EN 61193-1J-STD-002IPC-OI-645IEC 61188-5-3IEC 61189-5-502IEC 61188-5-4EN 61188-7J-STD-006IEC 61188-5-5EN 61193-3J-STD-004IEC 62326-1IEC 61188-7IEC 61188-5-1IEC 62326-4EN 61188-5-2J-STD-001IEC 61190-1-2EN 61188-5-3J-STD-020IPC-9202EN 61188-5-6IPC-TM-650IEC 61193-1All current amendments available at time of purchase are included with the purchase of this document.