MIL MIL-P-13949/3B Notice 1-Cancellation-层压塑料片金属覆层（用于印刷线路板）基材GE 玻璃基编织大多数双功能环氧树脂通用覆铜（取代MIL-P-13949/3A）（S/S BY MIL-P-1394.9/4C）-国家数字标准馆

现行 MIL MIL-P-13949/3B Notice 1-Cancellation

到馆提醒

收藏跟踪

购买正版

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GE, GLASS BASE, WOVEN, MAJORITY DIFUNCTIONAL EPOXY RESIN, GENERAL PURPOSE, COPPER-CLAD (SUPERSEDING MIL-P-13949/3A) (S/S BY MIL-P-13949/4C) 层压塑料片金属覆层（用于印刷线路板）基材GE 玻璃基编织大多数双功能环氧树脂通用覆铜（取代MIL-P-13949/3A）（S/S BY MIL-P-1394.9/4C）

发布日期： 1988-06-14

分类信息

发布单位或类别：美国-美国军事规范和标准

关联关系

研制信息

相似标准/计划/法规

JIS C 6482-1997

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
印制线路板用覆铜层压板纸基环氧树脂

BS EN 60249-2-3-1994

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

MIL MIL-S-13949/31

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
基材BI（非织造芳纶增强、聚酰亚胺树脂、金属包覆或非包覆）层压印刷线路板薄板（无S/S文件）

MIL MIL-S-13949/31 Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
片材印刷线路板层压基材BI（非织造芳纶增强材料聚酰亚胺树脂金属包覆或未包覆）（无S/S文件）

MIL MIL-P-13949/8D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
覆铜箔阻燃聚四氟乙烯树脂编织玻璃基GT基材金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/8C）（无S/S文件）

MIL MIL-P-13949/8D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GT 玻璃基编织聚四氟乙烯树脂阻燃覆铜（取代MIL-P-13949/8C）（无S/S文件）

MIL MIL-P-13949/8D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
塑料片层压材料金属层（印刷线路板）基材GT 玻璃基 WOVEN 聚四氟乙烯树脂耐火树脂铜箔（取代MIL-P-13949/8C）（NO S/S文件）

JIS C 6483-1997

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
印制线路板用覆铜层压板合成纤维织物基环氧树脂

MIL MIL-P-13949/6D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
覆铜阻燃聚四氟乙烯树脂无纺布基材GP玻璃基金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/6C）（无S/S文件）

MIL MIL-P-13949/6D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
塑料片层压材料金属层（印刷线路板）基材GP 玻璃基非织造布聚四氟乙烯树脂耐火树脂铜箔（取代MIL-P-13949/6C）（无S/S文件）

MIL MIL-P-13949/6D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GP 玻璃基无纺布聚四氟乙烯树脂阻燃覆铜（取代MIL-P-13949/6C）（无S/S文件）

MIL MIL-P-13949/6D Notice 2-Inactivation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GP 玻璃基无纺布聚四氟乙烯树脂阻燃覆铜（取代MIL-P-13949/6C）（无S/S文件）

MIL MIL-P-13949/14A

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
微波应用用覆铜层压金属覆层塑料板（用于印制线路板）基材GY 玻璃基编织聚四氟乙烯树脂阻燃（取代MIL-P-13949/14）（无S/S文件）

MIL MIL-P-13949/7E

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
微波应用用覆铜层压金属覆层塑料板（用于印制线路板）基材GF 玻璃基无纺布聚四氟乙烯树脂阻燃（代替MIL-P-13949/7D）（无S/S文件）

MIL MIL-P-13949/14A Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
塑料板层压板金属层（印刷线路板）基材GY 玻璃基板聚四氟乙烯树脂耐火材料用于微波应用铜箔（取代MIL-P-13949/14）（NO S/S文件）

MIL MIL-P-13949/7E Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GF 玻璃基无纺聚四氟乙烯树脂阻燃微波应用覆铜（取代MIL-P-13949/7D）（无文件）

MIL MIL-P-13949/14A Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GY 玻璃基编织聚四氟乙烯树脂阻燃微波应用覆铜（取代MIL-P-13949/14）（无S/S文件）

MIL MIL-P-13949/14A Notice 2-Inactivation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GY, GLASS BASE WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/14) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GY 玻璃基编织聚四氟乙烯树脂阻燃微波应用覆铜（取代MIL-P-13949/14）（无S/S文件）

MIL MIL-P-13949/7E Notice 02118-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GF, GLASS BASE, NONWOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, FOR MICROWAVE APPLICATION, COPPER-CLAD (SUPERSEDING MIL-P-13949/7D) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板）基材GF 玻璃基无纺聚四氟乙烯树脂阻燃微波应用覆铜（取代MIL-P-13949/7D）（无文件）

BS 4584-103.1-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制线路板用金属覆层基材与印刷电路有关的特殊材料多层印制板制造中用作粘合片材料的预浸料规范

《国家标准化发展纲要》提出建设国家数字标准馆，推动标准化工作向数字化、网络化、智能化转型。中国标准化研究院正在全力推进国家数字标准馆建设，力争在2026年底建成“一个中心”和“一个平台”，即全球领先的标准数据资源中心，涵盖标准全生命周期的数字化、网络化、智能化研究与服务平台。

专题数据库

标准管理系统

大数据分析系统

标准智能研制系统