Requirements for Solder Paste Printing
锡膏印刷要求

2012-05-01

微波组件印制板焊膏印刷工艺技术要求
Technical requirements for pasting solder on PCB of microwave assembly

2018-01-18

HALOPROGIN CREAM (S/S BY A-A-54119)
哈洛普金乳膏（S/S由A-A-54119提供）

1975-09-10

HALOPROGIN CREAM, USP (NO S/S DOCUMENT)
美国药典哈洛普金乳膏（无S/S文件）

1990-03-30

Solder paste -- Part 3: Test methods for printability, viscosity, slump and tackiness
锡膏第3部分:印刷适性、粘度、坍落度和粘性的试验方法

2014-01-01

蘑菇及其制品中鹅膏毒肽类蘑菇毒素的快速检测 胶体金免疫层析法

2023-10-13

Aerospace series - Gold base alloy AU-B40001 (AuNi18) - Filler metal for brazing - Powder or paste.
航空航天系列.金基合金AU-B40001（AuNi18）.钎焊用填充金属.粉末或膏体

2002-04-30

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第5-3部分:材料和组件的一般测试方法 - 印刷电路板组件的焊膏

2015-01-08

Aerospace series - Gold base alloy AU-B40001 (AuNi18) - Filler metal for brazing, powder or paste; German version EN 3960:2001
航空航天系列.金基合金AU-B40001（AuNi18）.钎焊用填充金属 粉末或膏体；德文版EN 3960:2001

2002-03-01

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
表面安装技术.第3-1部分:通孔回流焊（THR）组件规范的标准方法.使用焊膏表面印刷法的通孔直径设计指南

2022-06-17