Draft Document - Amendment 2 to IEC 61189-3: Test methods for electrical material, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 91/314/CD:2002)
文件草案——IEC 61189-3修正案2:电气材料、互连结构和组件的试验方法——第3部分:互连结构的试验方法（IEC 91/314/CD:2002）

2002-11-01

IEC 61249-6-3 ED.1.0. Materials for interconnection structures. Part 6-3. Sectional specification for reinforcements. Woven fibreglass fabrics
IEC 61249-6-3第1.0版 互连结构材料 第6-3部分 钢筋分规范 玻璃纤维机织物

2003-05-30

Draft Document - Eurocode 6 - Design of masonry structures - Part 3: Simplified calculation methods for unreinforced Masonry structures; German and English version prEN 1996-3:2021
文件草案——欧洲规范6——砌体结构设计——第3部分:无钢筋砌体结构的简化计算方法；德文和英文版本prEN 1996-3:2021

2021-10-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (IEC 91/1548/CD:2018); Text in German and English
文件草案——印制板和其他互连结构用材料——第6-3部分:增强材料分规范集——印制板用“E”玻璃编织成品织物规范（IEC 91/1548/CD:2018）；德语和英语文本

2019-04-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Mater
文件草案.电气材料 印制板和其他互连结构和组件的试验方法.第2-501部分:互连结构材料的试验方法.柔性介质材料的回弹强度和回弹强度保持系数的测量

2020-12-01

Materials for printed boards and other interconnecting structures – Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from “E” glass for printed boards
印制板和其他互连结构用材料.第6-3部分:增强材料分规范集.印制板用“E”玻璃编织成品织物规范

2023-06-14

Draft Document - Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (IEC 91/752/CD:2008)
文件草稿.印制板和其他互连结构用材料.第3-1部分:挠性板用覆铜层压板（粘合剂和非粘合剂类型）（IEC 91/752/CD:2008）

2008-05-01

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs (IEC 91/1186/CD:2014)
文件草稿-电气材料、印制板和其他互连结构和组件的试验方法-第3-913部分:高亮度LED用电子电路板导热性的试验方法（IEC 91/1186/CD:2014）

2014-09-01

Draft Document - Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys (IEC 91/879/CD:2009)
文件草稿.电气材料 互连结构和组件的试验方法.第11部分:焊接合金熔化温度和熔化温度范围的测量（IEC 91/879/CD:2009）

2009-11-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (IEC 91/1543/CD:2018); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-801部分:基材的热导率试验（IEC 91/1543/CD:2018）；德语和英语文本

2019-04-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (IEC 91/1749/CD:2021); Text in German and English
文件草稿.印制板和其他互连结构用材料.第2-51部分:包覆和未包覆的增强基材.未包覆的集成电路卡载带用基材（IEC 91/1749/CD:2021）；德语和英语文本

2022-06-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-805部分:TMA对薄基材的X/Y CTE试验（IEC 91/1696/CD:2020）；德语和英语文本

2022-03-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board (IEC 91/1545/CD:2018); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-803部分:基材和印制板Z轴膨胀的试验方法（IEC 91/1545/CD:2018）；德语和英语文本

2019-05-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-809部分:TMA厚基材的X/Y热膨胀系数试验（CTE）（IEC 91/1747/CD:2021）；德语和英语文本

2022-03-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 91/1546/CD:2018); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-804部分:分层时间试验方法——T260、T288和T300（IEC 91/1546/CD:2018）；德语和英语文本

2019-05-01

Draft Document - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第2-808部分:用热瞬态法测定介电层的热阻（IEC 91/1690/CD:2020）；德语和英语文本

2022-03-01

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (IEC 91/1569/CD:2019); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第5-501部分:材料和组件的一般试验方法——焊剂的表面绝缘电阻（SIR）试验（IEC 91/1569/CD:2019）；德语和英语文本

2019-11-01

Draft Document - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles (IEC 91/1620/CD:2019); Text in German and English
文件草案——电气材料、印制板和其他互连结构和组件的试验方法——第5-301部分:印制板组件的试验方法——使用细焊料颗粒的焊膏（IEC 91/1620/CD:2019）；德语和英语文本

2020-12-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/744/CD:2007)
文件草稿.文件草稿.印制板和其他互连结构用材料.第2-41部分:包覆和未包覆的增强基材.规定可燃性的包铜溴化环氧纤维素纸/编织E玻璃增强层压板（垂直燃烧试验）

2008-03-01

Draft Document - Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 91/753/CD:2008)
文件草稿.文件草稿.印制板和其他互连结构用材料.第2-42部分:包覆和未包覆的增强基材.规定可燃性的包铜溴化环氧无纺/编织E玻璃增强层压板（垂直燃烧试验）

2008-04-01