现行

KS D 6704

땜납
软钎料

2021-12-30

现行

MIL MIL-O-55310/22A Notice 1-Cancellation

OSCILLATORS, CRYSTAL, TYPE 3, (TEMPERATURE COMPENSATED (TCXO) ), 3.2 MHZ, SOLDER SEAL, SQUARE WAVE, CMOS (NO S/S DOCUMENT)
振荡器 晶体 类型3 （温度补偿（TCXO）） 3.2 MHZ SOLDER SEAL SQUARE WAVE CMOS（NO S/S文件）

1994-02-23

现行

MIL MIL-O-55310/22A Amendment 1

OSCILLATORS, CRYSTAL, TYPE 3, (TEMPERATURE COMPENSATED (TCXO) ), 3.2 MHZ, SOLDER SEAL, SQUARE WAVE, CMOS (NO S/S DOCUMENT)
振荡器 晶体 类型3 （温度补偿（TCXO）） 3.2 MHZ SOLDER SEAL SQUARE WAVE CMOS（NO S/S文件）

1988-05-10

现行

DIN 32506-1

Testing of Solderability for Soft Soldering; Wetting tests
软钎焊可焊性测试；润湿试验

1981-07-01

现行

YS/T 93-2015

膏状软钎料规范
Paste soft solder specification

2015-04-30

现行

SJ 3204-1989

软钎焊剂的名词术语
Terms for soft soldering fluxes

1989-02-10

现行

SJ 3203-1989

软钎焊剂的分类
Classification for soft soldering fluxes

1989-02-10

现行

BS EN ISO 10564-1997

Soldering and brazing materials. Methods for the sampling of soft solders for analysis
焊接和钎焊材料 软钎料分析取样方法

1997-04-15

现行

JIS Z 3282-2017

Soft solders -- Chemical compositions and forms
软钎料化学成分和形态

2017-01-01

现行

GB/T 15829-2021

软钎剂 分类与性能要求
Soft soldering flux—Classification and requirements

2021-12-31

现行

KS D ISO 9453

연납 합금 — 화학 조성과 형태
软焊合金 - 化学成分和形式

2021-01-26

现行

ISO 9453-2020

Soft solder alloys — Chemical compositions and forms
软焊合金 - 化学成分和形式

2020-09-24

现行

BS EN ISO 9453-2020

Soft solder alloys. Chemical compositions and forms
软钎料合金 化学成分和形态

2020-10-13

现行

BS EN ISO 9454-2-2020

Soft soldering fluxes. Classification and requirements-Performance requirements
软钎焊剂 分类和要求

2020-11-10

现行

BS EN ISO 9455-10-2012

Soft soldering fluxes. Test methods-Flux efficacy test, solder spread method
软钎焊剂 测试方法

2012-11-30

现行

UNE-EN ISO 10564-1997

SOLDERING AND BRAZING MATERIALS. METHODS FOR THE SAMPLING OF SOFT SOLDERS FOR ANALYSIS. (ISO 10564:1993).
焊接和钎焊材料 软钎料分析取样方法 （ISO 10564:1993）

1997-05-23

现行

DIN 32506-2

Testing of solderability for soft soldering; Vertical dipping test for specimens of copper alloys; Testing; Assessment
软钎焊可焊性测试；铜合金试样的垂直浸渍试验；测试；看法

1981-07-01

现行

DIN 32506-3

Testing of solderability for soft soldering; Vertical dipping test for pre-tinned specimens; Testing; Assessment
软钎焊可焊性测试；预镀锡试样的垂直浸渍试验；测试；看法

1981-07-01

现行

KS D 8546

무연 연납 — 화학 조성과 형상
无铅软钎料合金 化学组成和形态

2018-12-17

现行

KS D 8546(2023 Confirm)

무연 연납 — 화학 조성과 형상
无铅软焊料合金.化学成分和形式

2018-12-17