现行

MIL MIL-S-13949/32

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, FLAME RESISTANT) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材BI（非织造芳纶增强、聚酰亚胺树脂、阻燃）（无S/S文件）

1994-03-17

现行

MIL MIL-S-13949/32 Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, FLAME RESISTANT) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材BI（无纺芳纶增强材料、聚酰亚胺树脂、阻燃）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/31

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
基材BI（非织造芳纶增强、聚酰亚胺树脂、金属包覆或非包覆）层压印刷线路板薄板（无S/S文件）

1994-03-17

现行

MIL MIL-S-13949/31 Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BI (NONWOVEN ARAMID REINFORCEMENT, POLYIMIDE RESIN, METAL CLAD OR UNCLAD) (NO S/S DOCUMENT)
片材 印刷线路板 层压 基材BI（非织造芳纶增强材料 聚酰亚胺树脂 金属包覆或未包覆）（无S/S文件）

1997-08-01

现行

BS 4584-103.1-1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 多层印制板制造中用作粘合片材料的预浸料规范

1990-02-28

现行

MIL MIL-S-13949/23B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/23A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材BF（非织造芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/23A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/20A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材QI（编织石英增强、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1993-12-06

现行

MIL MIL-S-13949/20A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材QI（编织石英增强材料、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/20A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL QI (WOVEN QUARTZ REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/20) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材QI（编织石英增强材料、聚酰亚胺树脂）（替代MIL-S-13949/20）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/13C Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GI（编织电子玻璃增强材料、聚酰亚胺树脂）（取代MIL-S-13949/13B）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/13C Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GI（编织电子玻璃增强材料、聚酰亚胺树脂）（取代MIL-S-13949/13B）（无S/S文件）

1998-11-30

现行

MIL MIL-S-13949/13C

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GI (WOVEN E-GLASS REINFORCEMENT, POLYIMIDE RESIN) (SUPERSEDING MIL-S-13949/13B) (NO S/S DOCUMENT)
薄板、印刷线路板、预浸料、基材GI（编织E玻璃增强、聚酰亚胺树脂）（替代MIL-S-13949/13B）（无S/S文件）

1993-08-06

现行

MIL MIL-S-13949/16B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材AF（编织芳纶增强、环氧树脂、阻燃）（替代MIL-S-13949/16A）（无S/S文件）

1993-03-28

现行

MIL MIL-S-13949/16B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/16B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材AF（芳纶编织增强材料、环氧树脂、阻燃）（取代MIL-S-13949/16A）（无文件）

1998-11-30

现行

MIL MIL-S-13949/11B

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
板材、印刷线路板、预浸料、基材GE（编织E-玻璃增强、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1994-06-06

现行

MIL MIL-S-13949/11B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GE (WOVEN E-GLASS REINFORCEMENT, MAJORITY DIFUNCTIONAL EPOXY RESIN) (SUPERSEDING MIL-S-13949/11A) (NO S/S DOCUMENT)
片材、印刷线路板、预浸料、基材GE（编织电子玻璃增强材料、多数双功能环氧树脂）（取代MIL-S-13949/11A）（无S/S文件）

1997-08-01

现行

MIL MIL-S-13949/22B

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
基材BF层压印刷线路板（非纺织芳纶增强、环氧树脂、金属包覆或非包覆）（替代MIL-S-13949/22A）（无S/S文件）

1993-01-25

现行

MIL MIL-S-13949/22B Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1997-08-01

现行

MIL MIL-S-13949/22B Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL BF (NONWOVEN ARAMID REINFORCEMENT, EPOXY RESIN, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/22A) (NO S/S DOCUMENT)
片状印刷线路板 层压 基材BF（无纺芳纶增强材料 环氧树脂 金属包覆或未包覆）（取代MIL-S-13949/22A）（无文件）

1998-11-30