板级循环弯曲试验方法旨在评估和比较手持式电子产品应用的加速试验环境中表面安装电子元件的性能。其目的是使试验方法标准化，以提供表面安装组件的可再现性能评估，同时复制产品级试验期间通常观察到的故障模式。这不是部件鉴定测试，也不是为了取代鉴定特定产品和组件可能需要的任何产品级测试。

The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surface mount electronic components in an accelerated test environment for handheld electronic products applications. The purpose is to standardize the test methodology to provide a reproducible performance assessment of surface mounted components while duplicating the failure modes normally observed during product level test. This is not a component qualification test and is not meant to replace any product level test that may be needed to qualify a specific product and assembly.