Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
电气材料、印制板和其他互连结构和组件的试验方法
BS EN 61189-3-719:2016 specifies a test method to monitor the resistance of single platedthrough
holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under
thermo-mechanical stress induced by temperature cycling.Cross References:IEC 60068-2-14IEC 60068-2-58:2015IEC 60194IPC-2221EN 60068-2-14EN 60068-2-58:2015EN 60194IPC 2221A:2003All current amendments available at time of purchase are included with the purchase of this document.