现行

GB/T 4724-2017

印制电路用覆铜箔复合基层压板
Composite base copper clad laminated sheets for printed circuits

2017-07-31

现行

GB/T 4723-2017

印制电路用覆铜箔酚醛纸层压板
Phenolic celluloss paper copper clad laminated sheets for printed circuit

2017-07-31

现行

GB/T 4722-2017

印制电路用刚性覆铜箔层压板试验方法
Test methods for rigid copper clad laminates for printed circuits board

2017-05-31

现行

GB/T 16315-2017

印制电路用覆铜箔聚酰亚胺玻纤布层压板
Polymide woven glass fabric copper clad laminated sheets for printed circuits

2017-07-31

现行

GB/T 4725-2022

印制电路用覆铜箔环氧玻纤布层压板
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits

2022-03-09

现行

SJ/T 11725-2018

印制电路用导热型覆铜箔环氧复合基层压板
Thermal conduction epoxy composites material copper-clad laminated sheets for printed circuits board

2018-04-30

现行

JIS C 6481-1996

Test methods of copper-clad laminates for printed wiring boards
印制线路板用覆铜层压板的试验方法

1996-01-01

现行

JIS C 6471-1995

Test methods of copper-clad laminates for flexible printed wiring boards
挠性印制线路板用覆铜层压板的试验方法

1995-01-01

现行

GB/T 13557-2017

印制电路用挠性覆铜箔材料试验方法
Test methods for copper-clad material for flexible printed circuits

2017-07-31

现行

JIS C 6490-1998

Base materials for printed circuits -- Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的聚酰亚胺玻璃纤维织物覆铜层压板（垂直燃烧试验）

1998-01-01

现行

BS 4584-13-1977

Specification for metal-clad base materials for printed circuits-Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13
印制电路用金属覆层基材规范 硅机织玻璃纤维覆铜层压板Si-GC-Cu-13

1977-11-30

现行

JIS C 6489-1999

Base materials for printed circuits -- Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的环氧无纺布/玻璃纤维增强覆铜层压板（垂直燃烧试验）

1999-01-01

现行

JIS C 6493-1999

Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板

1999-01-01

现行

BS 4584-5-1972

Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality: PF-CP-Cu-5
印制电路用金属覆层基材规范 中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-5

1972-07-28

现行

JIS C 6492-1998

Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃布覆铜层压板（垂直燃烧试验）

1998-01-01

现行

BS EN 60249-2-3-1994

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

现行

KS C IEC 60249-2-7(2017 Confirm)

인쇄 회로 기판 재료－ 제2부：규격－제7장：가연성 페놀셀룰로오스 종이 동입힘 적층판 (수직 연소 시험)
印制电路用基材第2部分:规范第7号规范:规定可燃性的酚醛纤维素纸覆铜层压板（垂直燃烧试验）

2002-05-30

现行

JIS C 6488-1999

Base materials for printed circuits -- Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的环氧纤维素纸芯、环氧玻璃布表面覆铜层压板（垂直燃烧试验）

1999-01-01

现行

KS C IEC 60249-2-1(2017 Confirm)

인쇄 회로 기판 재료－제2부：규격－제1장：고급형 페놀셀룰로오스 종이 동입힘 적층판
印制电路用基材第2部分:规范第1号规范:高电气质量酚醛纤维素纸覆铜箔层压板

2002-05-30

现行

UNE-EN 60249-2-2-1996

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY.
印刷电路的基材 第2部分:规范 规范2:酚醛纤维素纸覆铜层压板 经济质量

1996-10-14