现行

JIS C 6471-1995

Test methods of copper-clad laminates for flexible printed wiring boards
挠性印制线路板用覆铜层压板的试验方法

1995-01-01

现行

JIS C 6480-1994

General rules of copper-clad laminates for printed wiring boards
印制线路板用覆铜层压板通则

1994-01-01

现行

GB/T 4722-2017

印制电路用刚性覆铜箔层压板试验方法
Test methods for rigid copper clad laminates for printed circuits board

2017-05-31

现行

JIS C 6482-1997

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
印制线路板用覆铜层压板纸基环氧树脂

1997-01-01

现行

JIS C 6472-1995

Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film)
挠性印制线路板用覆铜层压板（聚酯膜、聚酰亚胺膜）

1995-01-01

现行

JIS C 6483-1997

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
印制线路板用覆铜层压板合成纤维织物基环氧树脂

1997-01-01

现行

BS EN 60249-2-3-1994

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

现行

SJ 20224-1992

印制线路板用阻燃型覆铜箔环氧玻璃布层压板详细规范
Detail specification for epoxide woven glass fabric copper-clad laminated sheets of flammability resistance for printed wiring boards

1992-11-19

现行

MIL MIL-P-13949/8D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GT 玻璃基 编织聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/8C）（无S/S文件）

1994-07-11

现行

MIL MIL-P-13949/8D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GT 玻璃基 WOVEN 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/8C）（NO S/S文件）

1988-03-28

现行

MIL MIL-P-13949/8D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GT, GLASS BASE, WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/8C) (NO S/S DOCUMENT)
覆铜箔阻燃聚四氟乙烯树脂编织玻璃基GT基材金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/8C）（无S/S文件）

1988-03-28

现行

MIL MIL-P-13949/6D Notice 1-Validation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/6C）（无S/S文件）

1994-07-11

现行

MIL MIL-P-13949/6D Notice 3-Cancellation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
塑料片 层压材料 金属层（印刷线路板） 基材GP 玻璃基 非织造布 聚四氟乙烯树脂 耐火树脂 铜箔（取代MIL-P-13949/6C）（无S/S文件）

1987-02-11

现行

MIL MIL-P-13949/6D Notice 2-Inactivation

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
层压金属覆塑料片（用于印刷线路板） 基材GP 玻璃基 无纺布 聚四氟乙烯树脂 阻燃 覆铜（取代MIL-P-13949/6C）（无S/S文件）

1997-08-01

现行

MIL MIL-P-13949/6D

PLASTIC SHEET, LAMINATED, METAL-CLAD (FOR PRINTED WIRING BOARDS), BASE MATERIAL GP, GLASS BASE, NON WOVEN, POLYTETRAFLUOROETHYLENE RESIN, FLAME RESISTANT, COPPER-CLAD (SUPERSEDING MIL-P-13949/6C) (NO S/S DOCUMENT)
覆铜阻燃聚四氟乙烯树脂无纺布基材GP玻璃基金属覆层层压塑料板（用于印制线路板）（代替MIL-P-13949/6C）（无S/S文件）

1987-02-11

现行

BS EN 61249-2-22-2005

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2005-08-24

现行

BS EN 61249-2-30-2013

Materials for printed boards and other interconnecting structures-Reinforced base materials clad and unclad. Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2013-04-30

现行

BS EN 61249-2-21-2003

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad-Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
印制板和其他互连结构用材料

2004-02-16

现行

BS EN 61249-2-36-2009

Materials for printed boards and other interconnecting structures-Reinforced base materials, clad and unclad. Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料

2009-06-30

现行

IEC 61249-2-7-2002

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
印刷电路板和其他互连结构材料 - 第2-7部分:强化基材包装和包装 - 环氧树脂编织的E玻璃层压板（垂直燃烧试验） 铜包层

2002-03-05