Test methods of copper-clad laminates for flexible printed wiring boards
挠性印制线路板用覆铜层压板的试验方法

1995-01-01

挠性印制电路用聚酯薄膜覆铜板
Copper-clad polyester film laminates for flexible printed circuits

2017-12-29

Test methods of copper-clad laminates for printed wiring boards
印制线路板用覆铜层压板的试验方法

1996-01-01

General rules of copper-clad laminates for printed wiring boards
印制线路板用覆铜层压板通则

1994-01-01

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
印制线路板用覆铜层压板纸基环氧树脂

1997-01-01

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
印制线路板用覆铜层压板合成纤维织物基环氧树脂

1997-01-01

Materials for printed boards and other interconnecting structures-Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
印制板和其他互连结构用材料 挠性板用覆铜层压板（粘合剂和非粘合剂类型）

2007-10-31

인쇄 회로 기판 및 기타 전자 배선용 재료－제3-1부：연성 기판용 동박 적층판(접착형 및 비접착형)
印制板和其他互连结构用材料第3-1部分:挠性板用覆铜板（粘合和非粘合型）

2012-11-19

인쇄 회로 기판 및 기타 전자 배선용 재료－제3-1부：연성 기판용 동박 적층판(접착형 및 비접착형)
印制板和其他互连结构用材料第3-1部分:柔性板用覆铜层压板（胶粘型和非胶粘型）

2012-11-19

印制线路板用阻燃型覆铜箔环氧玻璃布层压板详细规范
Detail specification for epoxide woven glass fabric copper-clad laminated sheets of flammability resistance for printed wiring boards

1992-11-19

Specifications-Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
规格

2001-04-15

Draft Document - Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) (IEC 91/752/CD:2008)
文件草稿.印制板和其他互连结构用材料.第3-1部分:挠性板用覆铜层压板（粘合剂和非粘合剂类型）（IEC 91/752/CD:2008）

2008-05-01

Materials for printed boards and other interconnecting structures -- Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad.
印制板和其他互连结构用材料第2-18部分:覆层和非覆层增强基材规定可燃性的覆铜聚酯无纺布玻璃纤维增强层压板（垂直燃烧试验）

2003-03-28

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
印刷电路板和其他互连结构材料 - 第2-4部分:强化基材 包层和未包覆 - 聚酯无纺布/编织玻璃纤维层压板（垂直燃烧试验） 铜包层

2001-12-19

인쇄회로기판 및 기타 전자배선용 재료－제2-18부：동박적층 난연등급(수직연소 시험)의 유리섬유 비직조 폴리에스테르 동박적층판 및 무동박적층판
印制板和其他互连结构用材料第2-18部分:覆层和非覆层增强基材规定可燃性聚酯无纺布玻璃纤维增强覆铜板

2011-07-28

인쇄회로기판 및 기타 전자배선용 재료－제2-18부：동박적층 난연등급(수직연소 시험)의 유리섬유 비직조 폴리에스테르 동박적층판 및 무동박적층판
印制板和其他互连结构用材料第2-18部分:覆层和非覆层增强基材规定可燃性的覆铜聚酯无纺布玻璃纤维增强层压板（垂直燃烧试验）

2011-07-28

Materials for printed boards and other interconnecting structures -- Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad.
印制板和其他互连结构用材料第2-4部分:覆层和非覆层增强基材规定可燃性的覆铜聚酯非织造/机织玻璃纤维层压板（垂直燃烧试验）

2003-03-28

Материалы для печатных плат и других структур межсоединений. Часть 2-4. Материалы основания армированные, фольгированные и нефольгированные. Листы армированные слоистые на основе тканого или нетканого стекловолокна, пропитанного полиэфирным связующим, нормированной горючести (вертикальный тест горения), фольгированные медью
印刷板和其他互连结构的材料 第2-4部分 加强基材 包覆和不包括 聚酯无纺布/编织玻璃纤维层压板具有明确的易燃性（垂直燃烧试验） 铜包层

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL CF (NONWOVEN POLYESTER, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/25A) (NO S/S DOCUMENT)
层压印刷线路板薄板 基材CF（无纺聚酯、环氧树脂、阻燃、金属包覆或非包覆）（取代MIL-S-13949/25A）（无文件）

1998-11-30

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL CF (NONWOVEN POLYESTER, EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/25A) (NO S/S DOCUMENT)
基材CF层压印刷线路板板材（无纺聚酯、环氧树脂、阻燃、金属包覆或非包覆）（替代MIL-S-13949/25A）（无S/S文件）

1993-01-25