IEC/TR 62258-8:2008（E）是一份技术报告，旨在促进半导体芯片产品（包括晶圆）的生产、供应和使用；单孔裸模；带有连接结构的芯片和晶片；最小或部分封装的芯片和晶片。本技术报告包含一个明确的模型模式，该模式描述了数据交换所需的元素，允许实现IEC 62258-1、IEC 62258-5和IEC 62258-6标准的要求，并提供了与IEC 62258-2中定义的交换结构互补的交换结构。它也是对IEC 62258中问卷的补充和兼容- 4.

IEC/TR 62258-8:2008(E), which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.